Electrical/Electronics

Wire Bonding to Pads in Tilted Planes

This technique can be used in industries where devices need to be made smaller and lighter, such as medical, aerospace, automotive, and military. NASA’s Jet Propulsion Laboratory, Pasadena, California Scientific imaging arrays need to have their individual imaging elements arranged in a close-spaced mosaic. The typical single imaging element is a silicon chip mounted on a larger support frame. This excess area of the support frame takes away valuable imaging space from the mosaic. This appears as a grid of black (no data) in the overall mosaic image. Making the support frame smaller makes the amount of lost data smaller, and the imaging elements can be spaced more closely together. Eliminating the support frame altogether brings the imaging elements even closer. This is referred to as four-side buttable.

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cFE/CFS Evolution for Multicore Platforms

Goddard Space Flight Center, Greenbelt, Maryland This effort ports the Core Flight Executive (cFE)/Core Flight System (CFS) flight software architecture to multicore processor platforms, and provides mission developers with a common, flightready, flexible software environment that supports single, multi-processor, and multicore systems. Currently the cFE/CFS only supports single-core processors.

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Hermetic Feedthroughs for Mission-Critical Electronics

Sealed cavities are important in applications such as power electronics for missiles aboard ships or on high-altitude flights; automotive charging stations; and high-voltage power generation. Douglas Electrical Components, Randolph, New Jersey One of the most common causes of electronics failure is moisture. Because water and electronics do not mix well, several strategies exist to protect mission-critical components from moisture and condensation. One of the most successful methods involves hermetically sealed electronics cavities enabled by moisture-blocking component assemblies such as hermetic feedthrough technology.

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Ultra-High-Power W-Band/F-Band Schottky Diode-Based Frequency Multipliers

These multipliers can be used in millimeter-wave radars or radiometers in national security applications such as standoff personnel screening, mass transit security, and perimeter intrusion. NASA’s Jet Propulsion Laboratory, Pasadena, California All-solid-state, room-temperature, multipixel, sub milli meter-wave re ceiv ers are in demand for efficient spatial mapping of a planet’s atmosphere composition and wind velocities for future NASA missions to Venus, Jupiter, and its moons. Roomtemperature operation based on Schottky diode technology is a must in order to avoid cryogenic cooling and enable long-term missions. This technology is also being successfully applied for very-high-resolution imaging radars for standoff detection of concealed weapons. For submillimeter-wave radar imaging, the main issue is that, in order to reach video frame rates with high image pixel density, multi-pixel focal plane transceiver arrays are needed to illuminate targets with many radar beams simultaneously.

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FPGA Reconfiguration with Accelerated Bitstream Relocation

Goddard Space Flight Center, Greenbelt, Maryland Partial bitstream relocation (PBR) on field programmable gate arrays (FPGAs) is a technique to re-scale parallelism of accelerator architectures at run time and enhance fault tolerance. PBR techniques have focused on reading inactive bitstreams stored in memory, on-chip or off-chip, whose contents are generated for a specific partial reconfiguration region (PRR) and modified on demand for configuration into a PRR at a different location.

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Real-Time LiDAR Signal Processing FPGA Modules

Goddard Space Flight Center, Greenbelt, Maryland A scanning LiDAR, by its inherent nature, generates a great deal of raw digital data. To generate 3D imagery in real time, the data must be processed as quickly as possible. One method of discerning time-of-flight of a laser pulse for a LiDAR application is correlating a Gaussian pulse with a discretely sampled waveform from the LiDAR receiver.

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Advanced, Ultra-Low-Loss, High-Frequency Package Module

This module could improve performance of radiometers, high-resolution spectrometers, radars, and communication receivers and/or transmitters. NASA’s Jet Propulsion Laboratory, Pasadena, California As electronic circuits approach submillimeter wavelength frequencies (300 GHz) and higher, the traditional low-loss method of packaging electronic circuits in waveguide modules for guiding the signal requires more attention. The reasons are that circuits at higher frequencies have lower signal power levels due to limited gain and output power of semiconductor devices. As a result, the power lost by signals in the waveguide propagation environment becomes even more important at higher frequencies. In addition, previous efforts have based higher-frequency waveguide modules on existing lower-frequency module concepts and internal components.

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