Electrical/Electronics

IEC 60601-1-2 Edition 4: New Requirements for Medical EMC

Plan now to ensure your medical devices comply with new IEC 60601-1-2 EMC 4th Edition standard requirements by the December 2018 effective date. Since the development cycle can be 2-3 years, it is important to understand the new standard now when designing medical devices.

Posted in: White Papers, White Papers, Electronics, Instrumentation, Bio-Medical, Medical

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Krytar Case Study — Leading the Way in the Broadband Component and Testing Industry

Headquartered in Sunnyvale, California, Krytar Inc. provides the highest standard of broadband test & measurement components to the RF and microwave industry, supporting the development of all types of systems including radar and satellite. When choosing the right partner for RF and microwave circuit prototype and manufacture, Krytar turned to Sunstone Circuits. Here's why.

Posted in: White Papers, Electronics & Computers

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Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing

Die attach adhesives serve a vital role in semi-conductor assembly, manufacturing and throughout the product life cycle. In this white paper, learn how they facilitate assembly and about the application process. Read why thin bond lines are so important for product life cycle. Bond strength is only one, albeit critical requirement for many applications; read about many other performance characteristics of epoxies and why they offer diverse solutions to meet critical application needs.

Posted in: White Papers, Electronics & Computers

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Ultra Low Thermal Resistant Adhesives for Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are particularly versatile for bonding, sealing and coating. Moreover, the use of filler materials in adhesives can help to fine tune the specific performance demands required to extend product life cycles and meet manufacturing requirements. Learn more about why and how ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.

Posted in: White Papers, Electronics & Computers

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Conductive Coatings Protect Circuitry from EM/RF and ESD

With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Posted in: White Papers, Electronics & Computers, RF & Microwave Electronics

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High-Speed Switched Serial Fabrics Improve System Design

Well into its third decade of widespread deployment, VME adopted the new VXS gigabit serial interface, clearly representing the most significant leap in backplane data transfer rates throughout its entire history. Because VXS delivered such a dramatic improvement in embedded system performance, the use of gigabit serial technology was extended to create VPX. The OpenVPX initiative followed shortly thereafter, as risk-averse government agencies mandated the need for industry-wide standards. The hallmark of any successful standard is that it continues to evolve with technology, and none offers a better example than VME’s evolution to VXS and VPX.

Posted in: White Papers, White Papers, Electronics & Computers

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High-Speed Real Time Recording Systems

In today’s world of high-speed A/D converters operating in the gigahertz range, real-time signal recording has become a challenging task that requires specialized hardware and intelligent application software. When designing a real-time recorder capable of streaming sustained data to disk at rates of up to 5 GB/sec and higher, the system developer has to consider the limitations presented by the recorder’s operating and file systems, the limitations of disk drive technology, the hardware interfaces, and the RAID controller technology.

Posted in: White Papers, White Papers, Electronics & Computers

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