Electrical/Electronics

Breakthrough Energy Innovation: Ambition and Urgency

Climate change goals, customer sustainability expectations and pressure to reduce waste demand ambition and urgency from industry to deliver breakthrough energy innovation. Engineering simulation is a key enabler to achieve these breakthroughs. From startups to multinationals, businesses are using engineering simulation to explore the much broader design spaces in the areas of advanced electrification, machine and fuel efficiency, aerodynamic design, effective lightweighting and thermal optimization.

Posted in: White Papers, Electronics & Computers, Energy, Simulation Software

Read More >>

Key Considerations for Powertrain HIL Test

Safety, availability, and cost considerations can make performing thorough tests of embedded control devices using the complete system impractical. Hardware-in-the-loop (HIL) simulation is a real-time test technique used to test these devices more efficiently. During HIL test, the physical system that interfaces to an embedded control device is simulated on real-time hardware, and the outputs of the simulator mimic the actual output of the physical system. The embedded controller “thinks” it is in a real system. HIL simulation meticulously tests embedded control devices in a virtual environment before proceeding to real-world tests of the complete system. This application note covers recommended best practices for powertrain HIL testing.

Posted in: White Papers, Electronics, Electronics & Computers, Simulation Software, Software

Read More >>

NASA’s Pursuit of Power

Advances in batteries and propulsion enable innovations in both terrestrial and deep-space power applications. Advances in Capacitor Materials Electrochemical capacitors, or supercapacitors, have gained intense interest as an alternative to traditional energy storage devices. Applications for supercapacitors range from plug-in hybrid electric vehicles (PHEVs) to backup power sources. While the power density of supercapacitors surpasses that of batteries, commercially available batteries have a significantly higher specific energy density.

Posted in: Articles, Aerospace, Power Management, Propulsion

Read More >>

AGM Thumbtack™ Valves for Small Enclosures: Smaller and Drier

Sensitive equipment such as optics and electronics can be damaged by humidity and condensation. Placing moisture-sensitive equipment inside a sealed enclosure reduces the risk of damage, but temperature and pressure variations can be problematic for a sealed enclosure if it does not have a pressure-relief mechanism.

Posted in: White Papers, Defense, Electronics, Electronics & Computers, Instrumentation

Read More >>

Tailor-made Computing Solutions Require Diverse I/O Functions

More than ever, users from industry and transportation expect the full system solution, but no longer want to have to worry about the cumbersome configuration and integration of individual hardware components and adapting the software. There is a very simple reason for this: the system supplier of their choice reduces the time to market and is also responsible for the entire system at the same time.

Posted in: White Papers, Communications, Electronics, Electronics & Computers, Electronics & Computers, Software

Read More >>

Stackable Form-Factor Peripheral Component Interconnect Device and Assembly

Applications include fault-tolerant computing systems, high-speed data acquisition, embedded servers, and intelligent transportation systems. The invention is a design for a peripheral component interconnect (PCI) local bus controller and target in a PC/104-Plus form-factor. The design uses a flash-based field programmable gate array (FPGA) to provide immediate functionality from power-on to avoid delay after power is applied. It can be reprogrammed from connectors directly on the board, and is able to both receive and drive the clock for system and local peripherals, allowing it to function as either a PCI bus host controller or PCI target device interface. Fully compliant with the PC/104-Plus specification, the design has associated schematics and Gerber files in a vendor-ready state. The design was developed to support ongoing research in fault-tolerant computing systems.

Posted in: Briefs, Electronics & Computers

Read More >>

Self-Healing Wire Insulation

Microcapsules release healant that repairs minor cuts, nicks, and abrasions. NASA’s Kennedy Space Center is seeking commercial partners for licensing or further development of a novel high-performance, flexible, low-melt polyimide film with self-healing properties. The self-healing properties of the film are provided by embedded microcapsules containing a solvent-soluble polyimide. When cut or otherwise damaged, these capsules release their contents, which dissolve and heal the damaged area.

Posted in: Briefs, Electronics & Computers

Read More >>

White Papers

Computer Aided Design of Suspension Mechanisms
Sponsored by Dr. C H Suh
The Ultimate Shaft-To-Hub Connection
Sponsored by Stoffel Polygon
Hermetic Feedthroughs Safeguard Mission-Critical Electronics
Sponsored by Douglas Electrical Components
Made in Space: 3D Printing in Zero-G
Sponsored by Stratasys
Traceability Best Practices for Systems Engineers
Sponsored by Jama
Adhesives, Sealants and Coatings for the Aerospace Industry
Sponsored by Master Bond

White Papers Sponsored By:

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.