Electronics & Computers

Magnetics Design: Specification, Performance & Economics

An informative white paper from Datatronics Romoland, Inc., provides a discussion of the design, development and delivery of affordable magnetic components. The design development process begins once performance requirements are specified. Upon design approval, the procurement of materials for a prototype build is initiated. During this stage, specifications are not final and options remain open for cost-effective production. Specifications must be reviewed and design trade-offs evaluated to ensure that the technical requirements are economically attainable with consideration given to performance and tolerance in relation to affordable cost.

Posted in: Electronics & Computers, White Papers

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New Circuits Can Function at Temperatures Above 650°F

Engineering researchers at the University of Arkansas have designed integrated circuits that can survive at temperatures greater than 350 degrees Celsius — or roughly 660 degrees Fahrenheit. Their work, funded by the National Science Foundation, will improve the functioning of processors, drivers, controllers and other analog and digital circuits used in power electronics, automobiles and aerospace equipment, all of which must perform at high and often extreme temperatures.

Posted in: Electronics & Computers, Electronic Components, Board-Level Electronics, Electronics, Power Management, Aerospace, Transportation, Automotive, Semiconductors & ICs, News

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Engineers Hope to Create Electronics That Stretch at the Molecular Level

Nanoengineers at the University of California, San Diego are asking what might be possible if semiconductor materials were flexible and stretchable without sacrificing electronic function?

Posted in: Electronics & Computers, Electronic Components, Board-Level Electronics, Electronics, Materials, Sensors, Semiconductors & ICs, News

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COVE: A CubeSat Payload Processor

This processor is a reconfigurable FPGA-based electronics payload for advanced data processing applications. NASA’s Jet Propulsion Laboratory, Pasadena, California The COVE (CubeSat Onboard processing Validation Experiment) Payload Processor is JPL’s first on-orbit demonstration with the Xilinx Virtex-5 FPGA (field-programmable gate array). The electronics payload is designed to provide a platform for advanced data processing applications while conforming to CubeSat specifications. Measuring 9 × 9.5 × 2 cm, COVE carries the new radiation-hardened Virtex-5 FPGA (V5QV), magnetoresistive RAM (MRAM), and phase-change memory. All data access to/from the payload is facilitated through a shared memory interface via a direct serial peripheral interface (SPI). Multiple configuration options enable COVE to be reconfigured in flight with new FPGA firmware.

Posted in: Electronics & Computers, Briefs

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Dynamic Range Enhancement of High-Speed Data Acquisition Systems

Reversible non-linear amplitude compression is used. John H. Glenn Research Center, Cleveland, Ohio The innovation is a technique to overcome hardware limitations of common high-speed data acquisition systems in order to be able to measure electronic signals with high dynamic range, wide bandwidth, and high frequency.

Posted in: Electronics & Computers, Briefs

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HALT Technique to Predict the Reliability of Solder Joints in a Shorter Duration

This methodology can reduce product development cycle time for improvements to packaging design qualification. NASA’s Jet Propulsion Laboratory, Pasadena, California The Highly Accelerated Life Testing (HALT) process subjects test articles to accelerated combined environments of thermal, dynamic, voltage, and current to find weak links in a given product design. The technique assesses fatigue reliability of electronic packaging designs used for long-duration deep space missions by testing using a wide temperature range (–150 to +125 °C), and dynamic acceleration range of up to 50g. HALT testing uses repetitive, multiple-axis vibration combined with thermal cycling on test articles to rapidly precipitate workmanship defects, manufacturing defects, and thermal cycling-related weak links in the design. This greatly reduces the product development time by rapidly finding problems and qualifying the packaging design quickly. Test vehicles were built using advanced electronic package designs using the surface mount technology process.

Posted in: Electronics & Computers, Briefs

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GaN Schottky Diode-Based Frequency Multiplier

New GaN fabrication process has been applied to the design fabrication and tests of frequency doublers and triplers. NASA’s Jet Propulsion Laboratory, Pasadena, California State-of-the-art GaAs Schottky diode technology, which is being used for local oscillators (LOs) in heterodyne receivers and transmitters for radar applications, has limitations in terms of power-handling capabilities. That makes it difficult to generate necessary LO power to drive multi-pixel heterodyne receivers beyond 500 GHz, and to extend the operation frequency of single-pixel receivers beyond 2 THz up to 4.7 THz (63 μm OI line).

Posted in: Electronics & Computers, Briefs

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White Papers

SpaceClaim in Manufacturing
Sponsored by SpaceClaim
Lubricant Selection: What Every Design Engineer Needs to Know
Sponsored by Magnalube
Advances in Laser Welding Systems and Technology for Medical Device Manufacturing
Sponsored by Miyachi Unitek
Is There an Easy Way to Cut the Cost of EWIS Compliance?
Sponsored by Mentor Graphics
White Paper: Computer System Design for Critical Applications
Sponsored by Sealevel
When Wire Feedthroughs Make Sense
Sponsored by Douglas Electrical Components

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