Electrical/Electronics

Guidelines for Ensuring PCB Manufacturability

The rules of PCB design have changed little over the years, but the demands on the boards themselves keep increasing. The need for smaller, more complex boards used in smartphones, tablets, and other handheld devices translates into less real estate for greater functionality.

Posted in: Tech Talks, Electronics & Computers, Manufacturing & Prototyping

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Tech Trend Report: Will GaN Knock out Silicon Semiconductors?

This whitepaper is the first in a series from Intercomp, a premier electronics component parts distributor with value analysis/value engineering services designed to help companies with product innovations, development, sourcing and quality management.

Posted in: White Papers, Electronics, Electronics & Computers

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Hybrid DC Circuit Breaker Based on Cryogenic Technique

This hybrid solution combines mechanical and solid-state technology. John H. Glenn Research Center, Cleveland, Ohio DC protection systems such as circuit breakers play a key enabling role for the DC power system in applications such as aviation, the power grid, and the like. Conventional electromagnetic circuit breakers are a mature technology. However, the large size and high response time make it unsuitable for an electrical system in aviation that requires fast response time. Compared with a mechanical circuit breaker, the solid-state circuit breaker based on high-power semiconductors can provide a fast response time to make the fault current fully controlled. The on resistance of the semiconductors creates high conduction loss, which leads to low efficiency. Therefore, a hybrid solution that combines both mechanical and solid-state technology is desired.

Posted in: Briefs, Electronics & Computers

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Modular Propulsion and Deployment Electronics System

The new approach is flexible enough to quickly accommodate design changes. Goddard Space Flight Center, Greenbelt, Maryland The Lunar Reconnaissance Orbiter (LRO) required an innovative and modular approach to the design and development of the electronics needed to control the propulsion and deployment components, as well as the electronics necessary to support safety inhibits for personnel and range requirements. Since these electronics would be designed in parallel with the systems they would interface with, they would need to be flexible enough to quickly accommodate ongoing design changes.

Posted in: Briefs, TSP, Electronics & Computers

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Fundamentals of Heat Pipes: Theory, Design Applications

With increased power requirements and reducing packaging size, thermal management is critical for to ensure optimum performance of key electronics in military, medical and other commercial applications. Heat Pipes, which are ‘super conductors’ of heat, are now being more frequently utilized to solve these challenging heat issues. Although heat pipes have been around for decades, many new applications for them continue to emerge.

Posted in: On-Demand Webinars, Electronic Components, Electronics

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Hardening Electronics Against Difficult High-Temperature Environments

This technology provides extended performance for enhanced digital electronics while significantly increasing mean time between failures (MTBF). Silicon Space Technology (SST), Austin, Texas A new technology delivers temperature hardening in a number of products at the CMOS process level while increasing overall product reliability and longevity. Providing solutions that operate successfully in extreme temperature applications in the oil and gas, space, automotive, aerospace, and medical industries, as well as broader applications like industrial automation and high-performance computing, is paramount. As a result of the technology, system engineers are able to extend the limits of what’s possible in designing ruggedized and broader electronics for today’s extreme and difficult environments.

Posted in: Briefs, Electronics & Computers

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Stacked Capacitor Special Lead Adapter

Goddard Space Flight Center, Greenbelt, Maryland The current installation method for tall, stacked capacitors is very cumbersome because the lead form is very sharp and prone to solder cracking due to thermal cycling. An astringent installation process was developed to obtain the best chance of a successful solder joint with a proper heel fillet so the chance of cracking is minimized.

Posted in: Briefs, TSP, Electronics & Computers

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