The effect of the number of reworks is examined on the reliability of this technology for harsh, extreme thermal environments.
During the past two decades, large, high-density, high-input/output (I/O) electronic interconnect SMT (surface mount technology) packages such as ceramic column grid arrays (CCGAs) have increased usage in avionics hardware of NASA projects. The test boards built with CCGA packages are expensive and often require rework to replace reflowed, reprogrammed, failed, or redesigned CCGA packages. Theoretically, a good rework process should have a similar temperature- time profile as that used for the original manufacturing process of solder reflow. A multiple rework process may be implemented with CCGA packaging technology to understand the effect of the number of reworks on the reliability of this technology for harsh, extreme, thermal environments.
Posted in: Electronics & Computers, Briefs
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