Application Briefs

Spacesuit Simulator Meets NASA Training Needs

Aurora Flight Sciences delivered a completed Space Suit Simulator (S3) to NASA following the successful completion of a Phase II Small Business Innovation Research (SBIR) effort.

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Video Wall Improves Collaboration

The renovated Payload Operations Integration Center, part of the Huntsville, AL-based Marshall Space Flight Center, features a new video wall. The wall includes a 2 × 12 array of monitors that uses RGB Spectrum’s OmniWall 32 Display Processor to route and display up to 32 input signals. The processor expands the ability of operators to share information in real time, such as live video feeds, diagrams, photographs, results of experiments, and information on power usage.

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Thrusters Support GOES-R Satellite Series

Aerojet Rocketdyne, a GenCorp company, has shipped the first set of four solar electric propulsion thrusters to Lockheed Martin at NASA’s Stennis Space Center in Mississippi. Lockheed Martin will integrate the Aerojet Rocketdyne SEP thrusters and associated power conditioning units and electrical cabling with the Geostationary Operational Environmental Satellite-R Series (GOES-R) spacecraft.

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Fault Management Modeling Improves Spacecraft Operability

Ridgetop Group has been selected for a Small Business Innovation Research (SBIR) contract from NASA. Under the agreement, Ridgetop will develop an advanced system that mitigates faults in complex systems, ranging from flight control to electric power distribution, with autonomic recovery requirements.

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Solar Sail Will Demonstrate “Propellant-less Propulsion”

The Sunjammer Mission team — including NASA, lead contractor L’Garde, Space Services Holdings (SSHI), and Micro Aerospace Solutions — is preparing to launch Sunjammer, the largest solar sail ever deployed, named in honor of legendary science fiction author Sir Arthur C. Clarke. In a 1963 novella, Clarke christened a solar sailing ship “Sunjammer,” powered only by the pressure created by photons from the Sun.

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Using CVD Diamond to Cool Hot Devices

Increasing power densities and decreasing transistor dimensions are hallmarks of many of today’s semiconductor devices, including high-voltage power transistors, laser diodes, and RF power amplifiers. GaN devices, such as power converters for photovoltaic cells and cellular base-station power amplifiers, are further enabling higher power densities in smaller die sizes. Both trends are significantly increasing the thermal management challenge within the chip and surrounding package or module.

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Couplings Synchronize Motion in Pipe Bending System

Pines Technology’s (Westlake, OH) Model 250 Heavy Duty CNC bender is a powerful automatic precision system for fast, repeatable bending of tube and pipe up to 10" in diameter. Providing fast setup and changeover advantages, this giant bender has an advanced level of programming to deliver automated high performance and flexibility in tube and pipe bending operations.

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