Products

EZ-ZONE™ ST

Watlow, St. Louis, MO, has introduced the EZ-ZONE™ ST integrated control loop that integrates temperature control, power control, safety shutdown, and power disconnect in a single package. The system features a PID temperature controller already connected to a high-amperage solid-state relay with the option of adding a properly sized heat sink, current measurement, an over/under temperature limit, a definite purpose mechanical contactor, and digital communications. A remote user interface also can be added. The control loop is modular and scaleable, allowing users to choose only the components they need. The system can be stacked into multiple configurations, and features back-panel or DIN rail mounting. Other features are a touch-safe package and ±0.1 percent temperature accuracy. The system can be used in temperature control applications in plastics processing, packaging, semiconductor processing, analytical instrumentation, and general equipment.

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Autodesk Inventor 11 3D

Autodesk, San Rafael, CA, has announced Autodesk Inventor 11 3D mechanical CAD software that provides an integrated set of tools for 3D design and documentation. The new release features "functional design," which enables users to create designs based on the functional requirements of a product before committing to complex model geometry. Users begin with a symbolic representation of the product and enter the requirements in order to test, simulate, and validate the design, rather than entering the geometric dimensions of its parts. Other new features include Dynamic Simulation, which lets designers determine how effectively a machine will perform under real-world conditions; Large Assembly Management to configure how much model data is loaded into memory; Assembly Configurations for designing and documenting families of related products in a single assembly file; and Advanced Shape Description for creating cast and molded parts.

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NEiNastran V9

Noran Engineering, Westminster, CA, has released NEiNastran V9 finite element analysis (FEA) software for engineering analysis and simulation. Performance enhancements include added support for model input files over 10 million lines in size, an enhanced Lanczos eigensolver, and improved performance for models with composite laminates and large numbers of plies where individual ply results are requested. The software also features new parabolic shell elements, automated super-element analysis, automated surface contact and weld generation, 3D composites using solid elements, vibration fatigue analysis, combined qualitative/quantitative result assessment, and an enhanced Nastran Editor that includes a fully automated HTML report generator, shear flow plots, assignment plots, and an enhanced X-Y plotting interface. The software is available for Windows, Linux, and UNIX platforms.

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USB-3101 analog data output device

NMeasurement Computing, Norton, MA, has released the USB-3101 analog data output device that is fully compatible with USB 1.1 and 2.0 ports. The full-speed device is supported under Microsoft(r) Windows(r) operating systems and provides four channels of analog voltage output, eight digital I/O connectors, and one 32-bit event counter. Analog output ranges are ±10V and 0-10V. It is powered by the 5V USB supply from a computer, with no external power required. All I/O connections are made to the screw terminals located along each side of the device. Software support includes InstaCal installation, calibration, and test software; universal programming libraries for LabVIEW and other programming languages; SoftWIRE graphical programming system; DASYLab for data acquisition and control; and MATLAB's Data Acquisition Toolbox for control and communication.

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DA-130 ruggedized notebook computer

Dewetron, Charlestown, RI, has introduced the DA-130 ruggedized notebook computer that includes the company’s proprietary SideHAND® battery power system, allowing it to run indefinitely without any external power source. Batteries are hot-swappable, and can be exchanged even when the system is running off battery power. The DA-130 features a full-length, full-sized PCI slot, allowing virtually any PCI card to be installed. Also included are an Intel Pentium® CORE DUO® processor that can be configured with 1 GB or more of RAM, a fast hard drive subsystem, and integrated RAID controller. Based on a mini-ITX motherboard form factor, the computer can be upgraded continuously by replacing the motherboard. An allmetal chassis features high-impact rubber edges and corners, protects against EMI and RFI, and meets MIL-STD-810F shock and vibration specs. The DA-130 features a high-brightness, 15" 1024x768 TFT display that enables the system to be used in outdoor environments or in a variety of lighting conditions.

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ZScanner 700

Z Corporation, Burlington, MA, has introduced the ZScanner 700, a handheld, self-positioning 3D scanner that can digitize 3D surfaces in real time. The scanner is part-referenced, orienting itself to the target object, rather than to an external device. This eliminates the need for fixed-position tripods, mechanical arms, or other positioning devices that must be within the line of sight of the target surface. The user also can move the target object during scanning, and displays a real-time, on-screen image of the surface being scanned. To scan, the user holds the scanner and "paints" the object with a projected laser crosshair. The surface is recorded by the scanner's dual cameras, and ZScan software, included with the scanner, generates a polygon mesh of the surface on the computer screen in real time. The scanner captures data in one continuous scan. The software automatically produces an .stl file for import into a 3D CAD package, or output to a 3D printer. The system is accurate to within ±0.05 mm, and detects changes in surface height down to 0.1 mm. For Free Info Visit http://info.hotims.com/10952-120

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13-bit magnetic sensor

Renishaw, Hoffman Estates, IL, has introduced a 13-bit magnetic sensor for rotary and angular positioning control. Providing 8,192 counts per revolution, the sensors are available in chip, chip-on-board, and ready-to-mount packaged versions. The solid-state, non-contact design features an integrated circuit chip that senses the position of a separate two-pole permanent magnet. Suited for difficult environmental requirements, the sensors provide -40°C to 125°C operational temperature range, and shock and vibration resistance. Friction-less, low-inertia operation enables 0.3° positioning accuracy at speeds to 30,000 rpm. They are available in models providing absolute, incremental, analog, or digital outputs, as well as simultaneous SSI and incremental output. Chip and chip-on-board models allow the sensors to be integrated into machinery and equipment designs. Packaged versions enclose the chip and electronics in metal cases. Enclosed units are used in rugged applications and environments; fully encapsulated versions are waterproof.

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