Products

Micro-ATX Motherboard (ESC Booth #1940)

The EL330-DR micro-ATX form factor motherboard from ITOX (East Brunswick, NJ) utilizes the Intel® Q45 Express chipset with Intel® I/O Controller Hub 10DO. The embedded board supports the 45nm Intel® Core™2 Quad processor Q9400 with up to 6MB of shared L2 cache and up to 1333 MHz Front Side Bus (FSB), delivering high-performance computing in multi-threaded and multitasking environments. The EL330-DR microATX platform supports Intel® Trusted Execution Technology (Intel® TXT) to protect against software-based attacks, and safeguard the confidentiality and integrity of data stored or created on an embedded system. The industrial motherboard features an integrated Intel® Graphics Media Accelerator 4500 to enhance multi-media applications. Maximum performance is leveraged with up to 8GB of DDR3 800 MHz or 1066 MHz memory and two PCIExpress Gigabit Ethernet controllers. The EL330-DR also provides four Serial ATA ports with speed up to 3Gb/s, one UltraDMA 100 controller supporting two IDE devices, eight USB 2.0 ports, two Serial COM ports, one PCI Express x16 slot, one PCI Express x8 slot, and two PCI slots. For Free Info Visit Here.

Posted in: Products, Products

Read More >>

Reference Design Platform (ESC Booth #626)

Express Logic, Inc. (San Diego, CA) and Renesas Technology America, Inc. (San Jose, CA) have teamed up to offer a comprehensive reference design platform for powerful, inexpensive media players. The media player platform is based on Renesas’ 200-MHz SuperH SH-2A microcontroller architecture and Express Logic’s ThreadX® RTOS, and enables access and display of media from USB flash drives or SD memory cards. The reference design features a 640x480 VGA display and application software that enables touch screen user interface, image display, and audio file play. Also featured is the ability to display and play PC-compatible image files (.jpg, .bmp) and audio files (.mp3, .wav, .wma, .aac, .ogg). The reference design is aimed at system developers, providing them with a starting point for their products that saves significant time and greatly assists in timely project completion and faster time to market. All software components are available through royalty-free licenses, which means that none of the software adds to bill-of-material cost. The device’s application code is designed to use its floating-point unit (FPU) and on-chip RAM for audio processing, while displaying images from a USB hosted memory stick or SD memory card on a VGA TFT LCD using its on-chip LCD controller. Peripheral drivers and a board support package are available as part of the reference design. For Free Info Visit Here.

Posted in: Products, Products

Read More >>

Bluetooth Modules (ESC Booth #1809)

Laird Technologies (St. Louis, MO) has introduced a range of Bluetooth® modules designed to support the demands of medical equipment manufacturers. Designed for data applications, the BTM411 is a fully integrated, sub-miniature Bluetooth data-oriented module based on Cambridge Silicon Radio’s BC04 chipset. Incorporating a full Bluetooth stack and supporting a serial port profile, the module provides a UART interface and comprehensive AT command set to allow easy interface to a host processor. For medical products that require DSP applications, the BTM520 series offers a wide range of functions including a high-gain, multilayer ceramic antenna that provides +10dBm output for multimedia requirements. The integrated Bluetooth stack provides a comprehensive range of profiles. The 32-bit Kalimba DSP, running at 64MIPS, allows onboard implementation of a variety of advanced applications. The modules are based on the latest Bluetooth standard, Version 2.1+EDR, and deliver Secure Simple Pairing. This allows for simpler user interfaces that make products easier to use and, subsequently, reduces support costs. Designed for high reliability, these modules support an industrial operating temperature range of -30ºC to +70 ºC. For Free Info Visit Here.

Posted in: Products, Products

Read More >>

Touchscreen Controller ICs (Esc Booth # 316)

Atmel® Corporation (San Jose, CA) has introduced charge-transfer, capacitive touchscreen controller ICs that are suitable for mobile phones and other personal electronics. Highly reliable standard Two Touch™ and Single Touch touchscreen controllers are available. Two Touch controller ICs can track and report one or two simultaneous touches as separate X and Y positions. Common user-initiated gestures, including tap, double tap, flick and drag, as well as two-touch gestures such as zoom in, zoom out, and rotate are implemented in the touchscreen controllers. Users can also implement the touch surface as a combination of touch keys and scrolling devices for additional flexibility – this is configurable by the host processor through the industry standard two-wire, I2C compatible interface. For single touch applications, a unique single layer sensor minimizes the mechanical stack. The reduction of scatter and absorption of the available backlight results in improved light transmission and reduced power consumption. The first Two Touch devices, AT42QT5320 and AT42QT5480, support screen sizes of up to 8" with a 16:9 aspect ratio. The single touch devices, AT42QT4120 and AT42AT4160, support screen sizes of up to 4.3" with aspect ratios of 16:9 or 4:3. The AT42QT5320 comes in a 5×5 mm QFN package. The AT42QT5480 is available in 5×5 mm BGA, a 7×7 mm QFN, and a 10×10mm TQFP package and also supports up to four user-controlled GPOs. All packages are RoHS-compliant. For Free Info Visit Here.

Posted in: Products, Products

Read More >>

SMP Virtual Machine (Esc Booth #1610)

Aonix® (San Diego, CA) now offers the PERC Ultra SMP with support for multicore hardware. PERC Ultra SMP is a multiprocessor and multicore solution for complex mission-critical embedded and real-time Java applications. When the Java language, initially designed for multithreaded programming environments, is coupled with Aonix’s PERC Ultra SMP virtual machine, developers are able to leverage full SMP benefits without rewriting code originally designed to run in older, uniprocessor systems. PERC Ultra’s real-time garbage collector ensures that real-time microsecond response can be guaranteed even in missioncritical applications. With PERC Ultra SMP, all Java threads access the same shared objects, making them free to relocate themselves within memory. It also allows threads to migrate between processors, a crucial element to load balancing in multicore systems. To handle these needs, Aonix has developed a special patent-pending synchronization technique that ensures that an application thread on one processor does not attempt to access an object while another process is relocating the desired object as part of the garbage collection process. This performance-optimized solution hinges on the generation of specialized code sequences by the PERC Ultra SMP JIT compiler and on an enhanced real-time garbage collection algorithm. For Free Info Visit Here.

Posted in: Products, Products

Read More >>

On-Chip Debug Solutions (Esc Booth #1840)

Macraigor Systems (Brookline Village, MA) has ported their proprietary OCDemon On-Chip Debug Technology to ARM Cortex-M3 processors and is offering full GNU toolsets to be used with these processors. Engineers developing applications for these new processors can control and debug their hardware designs and application software without the use of other system resources such as UARTs, Ethernet channels, or parallel ports. Macraigor’s JTAG interface devices are available for use with the ARM Cortex- M3 based cores as well as other ARM family devices including ARM 7, ARM 9, ARM 11, Freescale’s iMX series, XScale, and others. Debug method is available for hardware initialization and debug as well as Flash EEPROM programming, kernel, driver, and application software debug. For Free Info Visit Here

Posted in: Products, Products

Read More >>

3D Stacked IC Technology (Esc Booth # 1535)

IMEC (Leuven, Belgium) has announced significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5μm Cu through-silicon vias (TSV). The 3D stacked integrated circuits will be further developed on 200mm and 300mm wafers, integrating test circuits from participating partners. The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression. For Free Info Visit Here.

Posted in: Products, Products

Read More >>