Products

Ultra-Thin Silicon Solar Cells Process

IMEC (Leuven, Belgium) has developed a new method to produce ~50μm thin crystalline silicon wafers for use in solar cells. The process involves mechanically initiating and propagating a crack parallel to the surface of a Si wafer. The method makes use of industrially available tools, such as a screen printer and belt furnace, and is potentially kerf-loss free. Adding an ultra-thin wafer or foil of active silicon on top of a low-cost substrate is a solution to reducing the amount of high-grade silicon used in solar cells.

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Laser Marker

Automated Laser Corporation (Fort Wayne, IN) has introduced the LSG-10 Laser Marker, the next generation of their high-speed CO2 laser markers. The LSG-10 offers a larger marking window, more choices and sizes of text including all True Type fonts, increased speed, more focal length choices, and the ability to mark many popular image formats all with considerable speed and precision at an affordable price.

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VIUscan™

Creaform, Levis, QE, Canada, offers the VIUscan™, the latest addition to the Handyscan 3D line of handheld scanners, which are used for the design, manufacturing, and inspection of any type of parts or assembly. VIUscan is a selfpositioning, high-resolution, portable 3D color scanner that creates an exact representation of an object, and generates files that can be exported to most CAD platforms. The scanner features simultaneous texture and geometry acquisition, real-time rendering, true color acquisition via a built-in lighting system, adjustable uniform texture resolution, and automatic texture mapping. The texture and geometry of an object are automatically acquired in the same reference system and aligned together, eliminating an additional alignment step normally required after scanning. Resolution parameters enable users to increase or decrease the texture and geometry resolution, independent of one another. It requires no external reference system and no external tracking or positioning devices. A topmounted button lets users switch between color-textured geometry scanning or geometry scanning only. For Free Info Click Here.

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Product of the Month: LED Light Source

Carl Zeiss MicroImaging (Thornwood, NY) introduces the Colibri, a patented, high-performance light emitting diode (LED) light source for fluorescence microscopy. The narrow band LEDs replace conventional white light sources to produce extremely high contrast images with an excellent signal-to-noise ratio, enabling the detection of weak signals and fine details in applications ranging from routine biomedical research to complex live cell imaging. The intensity of the narrow-band LEDs can be quickly and accurately set for any wavelength and exactly adapted to the specimen.

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UV Spectral Metal Coating

Deposition Sciences, Inc. (Santa Rosa, CA) has released the UV Spectral Metal hybrid coating for ultraviolet (UV) curing and UV printing industries. The highly durable, advanced dichroic metal coating is used as the reflector behind the curing lamp. It is designed to maximize curing wavelengths between 220 nm and 400 nm and minimize the rest of the visible and infrared (IR) spectrum from 450 nm to 2200 nm. Mounting features such as slots, screw holes, and tabs can be formed into the mirror after coating.

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Laser Diode Driver and Temperature Controller

Wavelength Electronics (Bozeman, MT) introduces the LDTC 2/2 laser diode driver for integrated laser diode or LED modules that include temperature control, often utilized in medical diagnostic equipment, remote sensing, analytical instrumentation, military, and communication design. The unit combines the WLD3343 temperature controller and the WTC3243 laser diode driver in one compact package that supplies 2.2 amps of drive current to each component. Temperature is controlled by a PI loop with configurable heat and cool current limits. The LDTC 2/2 is compatible with A/B type lasers and allows photodiode power monitoring in constant current mode.

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Picosecond Cold Processing Laser

The RAPID picosecond cold processing laser from RPMC (O’Fallon, MO) has up to 50W TEMoo average power and pulse repetition rates of up to 1MHz. The lasers are ideal for high quality industrial micromachining. Over 10mm3 of material per minute can be abated coldly, without thermal side effects and virtually no heat affected zone, cracks, or burr at the edges. Green and UV outputs are optional. The laser is effective on all materials used in semiconductor, electronics, solar cell, aerospace, automotive, medical, microfluidics, and micro- mold technology.

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