Products

Wafer Processing Solution

Sarnoff Corporation (Princeton, NJ) has introduced Ultra-SenseTM, a complete wafer processing solution. Ultra-Sense combines Silicon-on-Insulator (SOI) wafer technology with low-cost, scalable fabrication techniques to provide manufacturable back-illuminated image sensors. Ultra-Sense back-illuminated image sensors improve the performance and lower costs of high-resolution CCD or CMOS imaging systems for cell phone camera modules, digital still cameras, Ultraviolet (UV) and Deep UV, Visible, Near Infrared (NIR) inspection systems, spectroscopy systems, and surveillance systems.

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Thin Film PV Scribing System

J. P. Sercel Associates (JPSA) (Manchester, NH) has introduced laser workstations for processing solar thin film photovoltaic (PV) products. The PV-5000 Thin Film PV Scribing System is based on the ChromaDiceTM DPSS laser platform and is designed for isolation and series interconnection of thin film solar cells. JPSA laser systems employ high peak power, short pulsed Diode Pumped Solid State (DPSS) laser sources to rapidly, selectively, and accurately remove a wide range of thin films from large glass, metal or polymer substrates.

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Laser Workstation

TRUMPF Inc. (Farmington, CT) has announced the Tru-Laser Station 5004, a compact workstation that accommodates manual and semiautomatic laser welding. It comes equipped with an integrated protective hood, inert gas feeder, welding fume exhaust system, and safety features. The two cameras of its built-in electronic stereomicroscope offer a complete, three-dimensional exposure of the work pieces. The work station also displays the laser parameters in the microscope. The TruPulse 103 laser, which is integrated into the housing of the TruLaser workstation, has 6 kilowatts of pulse power in the millisecond range, and the dynamic power supply enables short pulse rise times.

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Dual Hot Swap Controller

Linear Technology Corporation (Milpitas, CA) has introduced the LTC4224, a compact, low voltage Hot SwapTM controller for protecting boards and backplanes that uses two 1V to 6V voltage supplies. The LTC4224 enables safe insertion and removal of a module into a rail by limiting any in-rush currents large enough to create a glitch on the rail, which can cause other plug-in modules to malfunction. Peak fault currents are controlled in less than 1μs and an optional gate capacitor can be used to adjust the gate slew rate. The LTC4224 is suitable for optical networking, low voltage Hot Swap control, and electronic circuit breaker applications.

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Specimen Tracking System

Applied Scientific Instrumentation (Eugene, OR) has introduced PhotoTrack, a system specifically designed to solve the problem of tracking a moving specimen. Combined with ASI’s closed-loop DC servo motor stages, PhotoTrack allows users to keep free moving samples in their field-of-view (FOV). PhotoTrack uses a low-light-level rapid position-sensing quadrant PMT sensor to monitor a bright reference spot on the target. It then commands an ASI automated XY stage to maintain that spot in the center of a microscope’s field-of-view.

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Multimedia Kit

Moritex (Cambridge, UK) has introduced a multimedia kit for its LightScope industrial endoscopes that includes everything required to perform wide ranging portable inspection and video documentation tasks. The multimedia kit includes a high quality CCD camera, 2.5-inch TFT LCD screen, and a bracket to ensure secure mounting to the LightScope. Backed by SD flash card memory the multimedia kit enables users to capture, record, and view MP4 video clips in real time. Integral USB port and TV-out connection enable output of video clips to PCs and larger screen devices.

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Ultra-Thin Silicon Solar Cells Process

IMEC (Leuven, Belgium) has developed a new method to produce ~50μm thin crystalline silicon wafers for use in solar cells. The process involves mechanically initiating and propagating a crack parallel to the surface of a Si wafer. The method makes use of industrially available tools, such as a screen printer and belt furnace, and is potentially kerf-loss free. Adding an ultra-thin wafer or foil of active silicon on top of a low-cost substrate is a solution to reducing the amount of high-grade silicon used in solar cells.

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