Products

SMP Virtual Machine (Esc Booth #1610)

Aonix® (San Diego, CA) now offers the PERC Ultra SMP with support for multicore hardware. PERC Ultra SMP is a multiprocessor and multicore solution for complex mission-critical embedded and real-time Java applications. When the Java language, initially designed for multithreaded programming environments, is coupled with Aonix’s PERC Ultra SMP virtual machine, developers are able to leverage full SMP benefits without rewriting code originally designed to run in older, uniprocessor systems. PERC Ultra’s real-time garbage collector ensures that real-time microsecond response can be guaranteed even in missioncritical applications. With PERC Ultra SMP, all Java threads access the same shared objects, making them free to relocate themselves within memory. It also allows threads to migrate between processors, a crucial element to load balancing in multicore systems. To handle these needs, Aonix has developed a special patent-pending synchronization technique that ensures that an application thread on one processor does not attempt to access an object while another process is relocating the desired object as part of the garbage collection process. This performance-optimized solution hinges on the generation of specialized code sequences by the PERC Ultra SMP JIT compiler and on an enhanced real-time garbage collection algorithm. For Free Info Visit Here.

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On-Chip Debug Solutions (Esc Booth #1840)

Macraigor Systems (Brookline Village, MA) has ported their proprietary OCDemon On-Chip Debug Technology to ARM Cortex-M3 processors and is offering full GNU toolsets to be used with these processors. Engineers developing applications for these new processors can control and debug their hardware designs and application software without the use of other system resources such as UARTs, Ethernet channels, or parallel ports. Macraigor’s JTAG interface devices are available for use with the ARM Cortex- M3 based cores as well as other ARM family devices including ARM 7, ARM 9, ARM 11, Freescale’s iMX series, XScale, and others. Debug method is available for hardware initialization and debug as well as Flash EEPROM programming, kernel, driver, and application software debug. For Free Info Visit Here

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3D Stacked IC Technology (Esc Booth # 1535)

IMEC (Leuven, Belgium) has announced significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5μm Cu through-silicon vias (TSV). The 3D stacked integrated circuits will be further developed on 200mm and 300mm wafers, integrating test circuits from participating partners. The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression. For Free Info Visit Here.

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Video Recording Server

Videology Imaging Solutions, Greenville, RI, offers the 60SV12VA-B single-channel server that enables users to upgrade existing analog cameras to be IP-addressable and record remotely onto an SD card. The server incorporates the Extended-Recording System (ERS) firmware to allow for continuous or triggered video recording and rerecording of up to 16 GB of MJPEG video, without data loss. The server can record simultaneously and independently, and eliminates the need to cable back to the head end. Data can be stored and secured separately.

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HDTV Network Security Camera

The AXIS Q1755 network camera from Axis Communications, Chelmsford, MA, features HDTV performance in compliance with the SMPTE standard in resolution, color representation, and frame rate. It is designed for securing areas where greater image detail is required, such as airports and passport control areas. It delivers HDTV 1080i or 720 resolution, 16:9 aspect ratio, and supports both H.264 and Motion JPEG in full frame rate.

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Thermal Imaging Camera

Mikron Infrared, Oakland, NJ, offers the MCL320MF “smart” thermal imaging camera for use in process control applications where thermal data is needed to interface directly with process control systems, without the need for a PC or external software interface. It features 320 × 240 resolution, digital outputs, and streaming video, and can detect thermal abnormalities without multiple temperature sensors. It provides alarm notification directly to the process control system.

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CMOS Image Sensor

The MLX75307 CMOS image sensor from Melexis, Concord, NH, is designed for automotive front vision applications such as advanced driver assistance systems, high-beam assist, and night vision. It also can be used in medical and industrial applications. The sensor features a high-dynamic-range pixel matrix that extends the input and output dynamic ranges. It also feature a low-light response boost that increases image brightness and contrast in low-light conditions.

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