Products

Laser Workstations

J P Sercel Associates (JPSA) (Manchester, NH) offers its IX-4000 series high-throughput, high-speed Class 1 laser workstations. There are two systems in the 4000 series: the IX-4100 ChromaDice and IX-4600 CromAblate. Both are designed for automated wafer processing, with the ability to handle up to 300mm wafers. The IX-4100 ChromaDice is designed for wafer singulation applications, while the IX-4600 ChromAblate is ideal for LED production, selective wafer annealing, micro-drilling, thin film patterning, and 3-D micromachining.

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Synchro/Resolver Angle Measurement Instrument

The 8810AH synchro/resolver angle measurement instrument from North Atlantic Industries (Bohemia, NY) provides fully independent dual-inputs, high-resolution touch screen controls, 0.0001º resolution, 0.0015º accuracy, and auto-ranging inputs. The unit offers an optional 2.2 VA reference supply, LXI compatibility, 47 Hz to 20 KHz operating frequency, auto-phase correction, and interface compatibility with Ethernet, USB, IEEE-488, and parallel ports. The 8810AH can be set up to measure two independent angle inputs and display them individually or as a difference angle.

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Linear Photodiode Array

Sensors Unlimited, Inc. (Princeton, NJ) introduces the LC Series Linear Photodiode Array. The SU256LCS-2.6T2 detector array is available with 256 elements of extended response InGaAs material and is designed for wavelength range from 0.9 microns to 2.6 microns. The LC photodiode array package design includes a two-stage TEC and thermally optimized materials for multi-channel spectrometers that require high sensitivity, low power consumption, and long-term stability. Applications include biomedical analysis and industrial process control.

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Wafer Scanner

The Wafer Scanner 3840™ from Rudolph Technologies (Flanders, NJ) is for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The WS 3840 Inspection System uses Rudolph’s laser triangulation technology to provide fast and accurate measurements of bump height and coplanarity. A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy.

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Modular Vision Sensor Platform

LMI Technologies, Inc.(Vancouver, Canada) has released the FireSync™ platform that allows developing a single unified design for building vision applications ranging from smart sensors to complex web scanning systems, from specification to final assembly. The FireSync™ platform consists of tightly integrated OEM hardware and software components that include sensor controllers, camera and embedded sensors, machine vision software, industrial computers, and lighting. Components selected can be configured in a number of different ways.

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Core2 Duo COM Express Module

Ampro Computers Inc. (San Jose, CA) has released a computer- on-module (COM) based on Intel’s Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, Ram, graphics, networking, and PCI Express expansion in a 3.7 × 4.5-inch module that operates from - 40 to +85°C. The COM 840 has a 1.66Hz Intel® Core2 Duo L7500 processor with 4 MB of on-chip L2 cache, 800 MHz FSB (front side bus), and two SODIMM sockets for up to 4 GB of DDR2 RAM.

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EPIC and EBX Enclosures

WinSystems (Arlington, TX) has released the ENC-EPXG- 1000 enclosure for EPIC (Embedded Platform for Industrial Computers) and the ENC-EBC-G-1000 enclosure for EBX single board computer (SBC) systems. They are designed for embedded applications requiring mounting inside NEMA boxes, OEM machinery, wiring closets, equipment rooms, and other areas where it is necessary to protect an EPIC or EBX Single Board Computer system with PC/104 expansion. The enclosures are made from rustproof, lightweight aluminum. Aluminum is non-combustible, non-magnetic, non-sparking, non-toxic, recyclable, and thermally conductive to dissipate component heat.

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