Products

Synchro/Resolver Angle Measurement Instrument

The 8810AH synchro/resolver angle measurement instrument from North Atlantic Industries (Bohemia, NY) provides fully independent dual-inputs, high-resolution touch screen controls, 0.0001º resolution, 0.0015º accuracy, and auto-ranging inputs. The unit offers an optional 2.2 VA reference supply, LXI compatibility, 47 Hz to 20 KHz operating frequency, auto-phase correction, and interface compatibility with Ethernet, USB, IEEE-488, and parallel ports. The 8810AH can be set up to measure two independent angle inputs and display them individually or as a difference angle.

Posted in: Products

Read More >>

Linear Photodiode Array

Sensors Unlimited, Inc. (Princeton, NJ) introduces the LC Series Linear Photodiode Array. The SU256LCS-2.6T2 detector array is available with 256 elements of extended response InGaAs material and is designed for wavelength range from 0.9 microns to 2.6 microns. The LC photodiode array package design includes a two-stage TEC and thermally optimized materials for multi-channel spectrometers that require high sensitivity, low power consumption, and long-term stability. Applications include biomedical analysis and industrial process control.

Posted in: Products

Read More >>

Wafer Scanner

The Wafer Scanner 3840™ from Rudolph Technologies (Flanders, NJ) is for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The WS 3840 Inspection System uses Rudolph’s laser triangulation technology to provide fast and accurate measurements of bump height and coplanarity. A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy.

Posted in: Products

Read More >>

Modular Vision Sensor Platform

LMI Technologies, Inc.(Vancouver, Canada) has released the FireSync™ platform that allows developing a single unified design for building vision applications ranging from smart sensors to complex web scanning systems, from specification to final assembly. The FireSync™ platform consists of tightly integrated OEM hardware and software components that include sensor controllers, camera and embedded sensors, machine vision software, industrial computers, and lighting. Components selected can be configured in a number of different ways.

Posted in: Products

Read More >>

Core2 Duo COM Express Module

Ampro Computers Inc. (San Jose, CA) has released a computer- on-module (COM) based on Intel’s Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, Ram, graphics, networking, and PCI Express expansion in a 3.7 × 4.5-inch module that operates from - 40 to +85°C. The COM 840 has a 1.66Hz Intel® Core2 Duo L7500 processor with 4 MB of on-chip L2 cache, 800 MHz FSB (front side bus), and two SODIMM sockets for up to 4 GB of DDR2 RAM.

Posted in: Products

Read More >>

EPIC and EBX Enclosures

WinSystems (Arlington, TX) has released the ENC-EPXG- 1000 enclosure for EPIC (Embedded Platform for Industrial Computers) and the ENC-EBC-G-1000 enclosure for EBX single board computer (SBC) systems. They are designed for embedded applications requiring mounting inside NEMA boxes, OEM machinery, wiring closets, equipment rooms, and other areas where it is necessary to protect an EPIC or EBX Single Board Computer system with PC/104 expansion. The enclosures are made from rustproof, lightweight aluminum. Aluminum is non-combustible, non-magnetic, non-sparking, non-toxic, recyclable, and thermally conductive to dissipate component heat.

Posted in: Products

Read More >>

VPX SerDes Test Modules

Elma Electronics Inc. (Fremont, CA) has released the SerDes Test Modules for VPX systems. The modules are being offered in partnership with DFT Microsystems, a leader in high-density test solutions for highspeed semiconductor device interfaces. The SerDes modules are designed to plug into VPX backplanes and directly test the channel compliance. They can be used to test VPX switch and node cards and/or the backplane channels without requiring external equipment or special test fixtures.

Posted in: Products

Read More >>

White Papers

Reverse Engineering
Sponsored by Servometer
Internet of Things
Sponsored by HP
Troubleshooting EMI in Embedded Designs
Sponsored by Rohde and Schwarz A and D
Avoid the High Cost of Quality Failure
Sponsored by Arena Solutions
HIG™: Combining the Benefits of Inductive and Resistive Heating
Sponsored by iTherm Technologies
Testing Astronaut-Controlled Surface Robots from the International Space Station
Sponsored by HP

White Papers Sponsored By: