Products

Frame Grabber

American ELTEC, Las Vegas, NV, has released the PC_EYE/CL PCI Express frame grabber that supports base, medium, and full configurations. The PCI Express interface with four lanes delivers data rates of up to 1 GB/s for maximum-speed cameras with full interfaces. It also delivers speeds of up to 680 MB/s. The board has inputs for digital video data compliant with Camera Link standard Version 1.2. Each of the two on-board Mini-Delta-Ribbon 26-pin connectors supports four ports, enabling a total of eight ports to be used.

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Thermal Imaging Camera

LumaSense Technologies, Santa Clara, CA, offers the Mikron MikroSHOT portable thermal imaging camera, a radiometric thermal imager that offers pocket-sized portability. The Thermal-On-Visible mode allows for radiometric temperature data to be displayed directly on the visible image. The camera uses batteries or an AC adapter, and features a 2.7" display and 160 × 120 pixel image resolution.

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Telecentric Lenses

Edmund Optics, Barrington, NJ, offers the TECHSPEC® large-format telecentric lenses that can accommodate large-format industrial image sensors measuring up to 28.7 mm diagonally. They provide high-resolution images with a large field of view. The lenses are available in a variety of mounting formats, including C-mount, T-mount, and F-mount for compatibility with large-sensor cameras. An optional mounting clamp is available for use in benchtop set-ups. Lens aperture is adjustable from F/6 to F/22, and a locking iris prevents changes in adjustment in high-vibration environments.

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HD Camera

Toshiba Imaging Systems Division, Irvine, CA, has introduced the IK-HR1S HD camera, a 1/3" CMOS detector with 2.1 megapixels and optional 720p or 1080i scanning operation, both with HD-SDI output. The camera measures 1.75 × 1.65 × 3", and features an RS-232 serial interface and a C-mount lens interface for clear HD imagery and color resolution. It is designed for imaging applications requiring the option to switch from progressive to interlace scanning operation.

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In-Line Inspection

The VT-S700 in-line automated optical inspection system from Omron Electronics, Schaumburg, IL, shortens tact time of soldered component inspection with an expanded field of view. Using a telecentric lens with a 2-megapixel camera, the system reduces image distortion at the edges of the field of view. It delivers high-resolution inspection of up to 10 microns for components as small as .01005, and down to a 12-mil pitch. The system uses a three-color highlight system that illuminates the printed circuit board in a 360-degree dome. The 3-CCD camera enhances solder shape recognition accuracy and identifies lead-free solder joints. Auto-teaching modes automatically extract components based on model pattern data, and logic customization allows the system to adapt to future changes in component shapes and solder types. Optical character verification capability is available, and resolution can be selected for 10, 15, or 20 microns.

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Network Cameras

Panasonic, Secaucus, NJ, has introduced two IP network cameras, the BL-C101A and BL-C121A that monitor from a PC or cell phone. The BL-C101A features one-wire, plug-and-play installation; the BL-C121A is wireless and features IEEE 802.11 operation with an internal antenna. Both cameras can simultaneously capture MPEG-4 video and JPEG images, and include a free Web address from which users can remotely monitor the camera’s video. Both cameras have a built-in microphone. Other features include digital input for camera triggering, full-screen monitoring, image transfer by motion detection/timer, and 4-up, 9-up, and 16-up multi-camera pages.

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Image Sensors

Banner Engineering Corp., Minneapolis, MN, offers the iVu series image sensors that combine a photoelectric sensor and a vision sensor. They feature a touchscreen with intuitive interface and configurable inspection parameters. Three sensor types are offered in one rugged package for applications such as injection molding verification, label inspection, packaging verification, weld nut orientation, and electronic marking verification.

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