Products

Fiber Laser

Orbits Lightwave, Inc. (Pasadena, CA) has added up to a 20 GHz mode hop free fast tuning option to its line of EthernalTM fiber lasers.

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Test Module

EXFO Electro-Optical Engineering Inc. (Quebec City, Canada) introduced the FTB-8105 T-Carrier/PDH Transport Blazer test module as part of the Transport Blazer line. The unit tests digital-signal levels and plesio-synchronous digital hierarchy electrical rates as well as SONET/SDH rates up to 155 Mbps, and is suited for time-division-multiplexing field service deployment and maintenance applications. The module may be combined with the FTB-8510 Packet Blazer Ethernet module for Ethernet-over-TDM network deployments.

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Detector Array

The Andor iDus InGaAs detector array system from Andor Technology (Belfast, N. Ireland) is a spectroscopic detector with 512 or 1,024 element linear photodiode arrays for near-infrared spectroscopy. The resolution covers wavelengths from 800 nm to 2,200 nm. Features include a peak QE of less than 80% with reduced noise, thermo-electric cooling to -85°C, and USB 2.0 connectivity. A hermetic seal vacuum is guaranteed. Applications include Raman at longer wavelengths, LIDAR, and photoluminescence.

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Redundant Fieldbus System Switches Automatically to Backup

The TS Series TRUNKSAFE system from MooreHawke, a division of Moore Industries (North Hills, CA), maintains continuous communication between a control system and instruments on a Foundation Fieldbus H1 segment. In the event of a failure on the Fieldbus segment, TRUNKSAFE enables the control system to switch immediately and automatically to a redundant path, preventing loss of a complete segment, shutdown of equipment, or other process failures.

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System Host Board Features Intel® Processor Options

The TML graphics-class system host board (SHB) from Trenton Technology (Gainesville, GA) uses the Intel® Core™ Duo, Intel Core™ Solo, and Intel Celeron® M processor options, providing a low-profile passive cooling solution and enabling small chassis designs. The Intel Core Duo processor offers dual-core technology, a 667-MHz frontside bus, 2 MB of L2 cache, and Enhanced Intel Speed- Step® technology. The Intel 945G and Intel ICH7R component combination on the TML enables dual Gigabit Ethernet ports, eight USB 2.0 ports, and a 4-GB, dual-channel DDR2-667 memory interface. Other features include dual SATA2 drive capability supported by the Intel ICH7R, featuring Intel Matrix Storage Technology that directly supports RAID 0, 1, 5, and 10 implementations. PCI Express™ (PCIe) links designed into the TML support the high-speed PCIe interface methodology between the SHB and backplane defined in the PICMG 1.3 industry standard. The TML’s graphics-class PCIe link configuration supports PCI Express graphics and video cards, including ADD2 cards. Other types of PCI Express cards, as well as 32-bit/33-MHz PCI option cards, are supported directly by the TML on a PICMG® 1.3-compatible backplane.

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Baseboard Supports ETX-Compliant Solutions

Kontron (San Diego, CA) has introduced the Kontron ETX® miniBaseboard, a compact EXT baseboard that serves as a universal development platform for ETX 3.0-compliant modules.

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Real-time, Flash-based Microcontrollers

Atmel® Corp. (San Jose, CA) has introduced the SAM9 family of ARM9-based Flash microcontrollers (MCUs) for real-time embedded applications.

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