Products

Digital Camera

Vision Research, Wayne, NJ, offers the four-mega-pixel Phantom® v640 digital high-speed camera, which provides six gigapixel-per-second throughput and enhanced light sensitivity. It offers a recording speed of more than 1,400 frames per second at full resolution of 2560 × 1600. For higher frame rates, users can reduce resolution. It can record at more traditional frame rates for normal use — as low as 10 fps. The camera incorporates a proprietary CMOS imaging sensor. Micro-lens technology uses a tiny lens bound to each pixel to direct incoming light into the active areas of the photo site.

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Frame Grabber

American ELTEC, Las Vegas, NV, has released the PC_EYE/CL PCI Express frame grabber that supports base, medium, and full configurations. The PCI Express interface with four lanes delivers data rates of up to 1 GB/s for maximum-speed cameras with full interfaces. It also delivers speeds of up to 680 MB/s. The board has inputs for digital video data compliant with Camera Link standard Version 1.2. Each of the two on-board Mini-Delta-Ribbon 26-pin connectors supports four ports, enabling a total of eight ports to be used.

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Thermal Imaging Camera

LumaSense Technologies, Santa Clara, CA, offers the Mikron MikroSHOT portable thermal imaging camera, a radiometric thermal imager that offers pocket-sized portability. The Thermal-On-Visible mode allows for radiometric temperature data to be displayed directly on the visible image. The camera uses batteries or an AC adapter, and features a 2.7" display and 160 × 120 pixel image resolution.

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Telecentric Lenses

Edmund Optics, Barrington, NJ, offers the TECHSPEC® large-format telecentric lenses that can accommodate large-format industrial image sensors measuring up to 28.7 mm diagonally. They provide high-resolution images with a large field of view. The lenses are available in a variety of mounting formats, including C-mount, T-mount, and F-mount for compatibility with large-sensor cameras. An optional mounting clamp is available for use in benchtop set-ups. Lens aperture is adjustable from F/6 to F/22, and a locking iris prevents changes in adjustment in high-vibration environments.

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HD Camera

Toshiba Imaging Systems Division, Irvine, CA, has introduced the IK-HR1S HD camera, a 1/3" CMOS detector with 2.1 megapixels and optional 720p or 1080i scanning operation, both with HD-SDI output. The camera measures 1.75 × 1.65 × 3", and features an RS-232 serial interface and a C-mount lens interface for clear HD imagery and color resolution. It is designed for imaging applications requiring the option to switch from progressive to interlace scanning operation.

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In-Line Inspection

The VT-S700 in-line automated optical inspection system from Omron Electronics, Schaumburg, IL, shortens tact time of soldered component inspection with an expanded field of view. Using a telecentric lens with a 2-megapixel camera, the system reduces image distortion at the edges of the field of view. It delivers high-resolution inspection of up to 10 microns for components as small as .01005, and down to a 12-mil pitch. The system uses a three-color highlight system that illuminates the printed circuit board in a 360-degree dome. The 3-CCD camera enhances solder shape recognition accuracy and identifies lead-free solder joints. Auto-teaching modes automatically extract components based on model pattern data, and logic customization allows the system to adapt to future changes in component shapes and solder types. Optical character verification capability is available, and resolution can be selected for 10, 15, or 20 microns.

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Network Cameras

Panasonic, Secaucus, NJ, has introduced two IP network cameras, the BL-C101A and BL-C121A that monitor from a PC or cell phone. The BL-C101A features one-wire, plug-and-play installation; the BL-C121A is wireless and features IEEE 802.11 operation with an internal antenna. Both cameras can simultaneously capture MPEG-4 video and JPEG images, and include a free Web address from which users can remotely monitor the camera’s video. Both cameras have a built-in microphone. Other features include digital input for camera triggering, full-screen monitoring, image transfer by motion detection/timer, and 4-up, 9-up, and 16-up multi-camera pages.

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Image Sensors

Banner Engineering Corp., Minneapolis, MN, offers the iVu series image sensors that combine a photoelectric sensor and a vision sensor. They feature a touchscreen with intuitive interface and configurable inspection parameters. Three sensor types are offered in one rugged package for applications such as injection molding verification, label inspection, packaging verification, weld nut orientation, and electronic marking verification.

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2D and 3D Design and Engineering Software

Autodesk, San Rafael, CA, has introduced the latest releases of its 2D and 3D design and engineering software for manufacturers. The 2010 products include Autodesk Inventor, AutoCAD Mechanical, and AutoCAD Electrical. Autodesk Inventor 2010 features new capabilities for 2D product documentation and 3D product design, including automated capabilities for designing injection molds for plastic parts, and improved support for motion simulation and static and modal finite element analysis at both the part and assembly levels. Inventor also has a new user interface that combines an intuitive 3D design environment for creating parts and assemblies, with tools that drive the automatic creation of components such as plastic parts, steel frames, and rotating machinery. The new version of AutoCAD Mechanical includes intelligent drafting features for automating common design tasks. AutoCAD Electrical includes a new one-line circuit symbol library and enhancements to the Circuit Builder tool that lets designers analyze the energy efficiency of circuits for “green” engineering.

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Audio Enrichment Technology

ARC International (San Jose, CA), has introduced the Virtual Bass™ audio enrichment technology that delivers a deep rich bass response on existing speakers or headphones, eliminating the need to add subwoofers or other audio components. Virtual Bass optimizes a product’s bass rendering capabilities, taking into account the analog to digital converter, amplifier, speaker cavity, and speaker driver, resulting in audio that more accurately reflects the original performance without adding artificial signals or muffling voice articulation and audio clarity.

The low-power ARC® Sound Subsystem is a 100-hour audio playback solution for portable devices. When implemented on the ARC® Sound Subsystem, Virtual Bass offers a complete solution that lowers manufacturing cost while producing an enhanced listening experience. The complete solution includes an underlying silicon solution that cuts chip size and lowers power consumption, a complete set of software to provide playback of any digital music format, all the tools needed to develop the chip solution, and the complete Sonic Focus™ audio enrichment technology suite.

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