Features

LED Packaging with Silicone Encapsulants

By Michelle Velderrain and Matthew Lindberg, NuSil Technology When working together, the packager and silicone pro vider should take into account several details. One major consideration is the methodology used when packaging an LED, such as surface mount LED, compression molding or injection molding. Besides that, the end use of the LED and the longevity of the LED must be addressed. As we often find, producing an LED is a game of compromise – durability versus reliability. We will explore some of the basics of silicone to get a better understanding of the material. Also, we will delve into a few questions to be asked when packaging an LED, such as what type of material to use or what RI should be targeted. In all cases, the necessity of a relationship between the silicone provider and the LED manufacturer will become clearer.

Posted in: Articles, Lighting, Test & Inspection

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Bringing the Heat

New Thermal Characterization Testing Standard and Tools Allow More Accurate Thermal Analysis for LEDs and Semiconductors By John Parry, Mentor Graphics, Wilsonville, OR LED, semiconductor, and package designers use complex thermal analysis software to analyze their products, but the analysis is only as good as the data provided. Reliable clarification of heat data upstream and downstream is critical. The process of obtaining this clarification traditionally has been cumbersome, requiring manual intervention. But now, for the first time, an automated process combines accurate thermal measurement with precise analysis, giving companies the ability to design better LEDs and power semiconductor device packages, create accurate simulation models, and verify systems for proper heat management.

Posted in: Articles, Lighting, Materials & Packaging

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Designing High-Speed, Rugged Data Recorders

High-speed recorders represent a major share of electronic instrumentation found in commercial, industrial, scientific research, government, and defense applications. Each system captures specific classes of analog and digital inputs from among an enormous range of sensors, networks, and interfaces.

Posted in: Articles, Articles

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Improving Software Reliability in Satellite and Spacecraft Applications

In the space industry, much of the effort to refine system engineering processes has been done by hand using tools as divergent as Microsoft PowerPoint to IBM Rational Doors. While these tools are valuable, they do not provide a direct connection to source code and test results.

Posted in: Articles, Articles

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Solar Cell Manufacturing and Robot Automation: Right Fit, Right Robot

The United States has set 2015 as a goal to reach grid parity (that point where solar electricity is equal to grid electricity). No matter your thoughts on regulatory involvement, it is clear there will be a resurgence in investment, development, and innovation within the PV manufacturing community throughout the world, and it will largely be driven by technology. Finding the most effective tools and processes to gain more productivity and decrease costs within a set capital plan is paramount.

Posted in: Articles, Machinery & Automation, Robotics

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Motion Control and System Engineering Considerations

Motion control choices are best made in light of the whole system architecture, as the selection of system architecture will drive not only the implementation and integration stages of the project, but also manufacturing and field service, and even the ability to ship and install the final product. We will first review a quick tour of system engineering, and then go on to the motion control specifics.

Posted in: Articles, Motion Control

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Ames Research Center

NASA Ames Research Center is located in the heart of California’s Silicon Valley, surrounded by high-tech companies, universities, and laboratories. With over $3 billion in capital equipment, 2,500 research personnel, and a $900 million annual budget, Ames plays a critical role in virtually all NASA missions in support of America’s space and aeronautics programs.

Posted in: Articles, Aerospace

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