Features

Laser Workstations

J P Sercel Associates (JPSA) (Manchester, NH) offers its IX-4000 series high-throughput, high-speed Class 1 laser workstations. There are two systems in the 4000 series: the IX-4100 ChromaDice and IX-4600 CromAblate. Both are designed for automated wafer processing, with the ability to handle up to 300mm wafers. The IX-4100 ChromaDice is designed for wafer singulation applications, while the IX-4600 ChromAblate is ideal for LED production, selective wafer annealing, micro-drilling, thin film patterning, and 3-D micromachining.

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Synchro/Resolver Angle Measurement Instrument

The 8810AH synchro/resolver angle measurement instrument from North Atlantic Industries (Bohemia, NY) provides fully independent dual-inputs, high-resolution touch screen controls, 0.0001º resolution, 0.0015º accuracy, and auto-ranging inputs. The unit offers an optional 2.2 VA reference supply, LXI compatibility, 47 Hz to 20 KHz operating frequency, auto-phase correction, and interface compatibility with Ethernet, USB, IEEE-488, and parallel ports. The 8810AH can be set up to measure two independent angle inputs and display them individually or as a difference angle.

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Linear Photodiode Array

Sensors Unlimited, Inc. (Princeton, NJ) introduces the LC Series Linear Photodiode Array. The SU256LCS-2.6T2 detector array is available with 256 elements of extended response InGaAs material and is designed for wavelength range from 0.9 microns to 2.6 microns. The LC photodiode array package design includes a two-stage TEC and thermally optimized materials for multi-channel spectrometers that require high sensitivity, low power consumption, and long-term stability. Applications include biomedical analysis and industrial process control.

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Wafer Scanner

The Wafer Scanner 3840™ from Rudolph Technologies (Flanders, NJ) is for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The WS 3840 Inspection System uses Rudolph’s laser triangulation technology to provide fast and accurate measurements of bump height and coplanarity. A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy.

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Modular Vision Sensor Platform

LMI Technologies, Inc.(Vancouver, Canada) has released the FireSync™ platform that allows developing a single unified design for building vision applications ranging from smart sensors to complex web scanning systems, from specification to final assembly. The FireSync™ platform consists of tightly integrated OEM hardware and software components that include sensor controllers, camera and embedded sensors, machine vision software, industrial computers, and lighting. Components selected can be configured in a number of different ways.

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Green Energy for the Battlefield

The amount of energy the United States consumes increases every year and this growth in energy consumption outpaces energy production. To fill this gap, the U.S. imports 35% of its energy. More importantly, the U.S. imports over 60% of its total oil consumption. Added to this, 70% of this energy is from non-renewable sources.

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Creating Patterned Multispectral Filters

In recent years the explosion in demand for multispectral imaging has coupled with the industry’s insatiable need for weight reduction, thereby greatly increasing the demand for more sophisticated approaches to producing optical filters that are used in these systems. One method to meet the challenge of reducing the weight of a multispectral system is to eliminate beam-splitting optics and multiple detectors by patterning a filter array on a single substrate, or directly on the CCD itself.

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