Features

EPIC Single Board Computer

Diamond Systems (Mountain View, CA) has announced Neptune, an ultra-high-integration EPIC form factor single board computer that combines state-of-the-art CPU and I/O technology with Diamond Systems’ high accuracy data acquisition circuitry on a single board. Neptune offers up to 2GB of DDR/DDR2 DRAM via SODIMM and provides a PC/104-Plus interface for expansion, supporting both PCI and ISA. Software support is provided for Windows XP, Linux, Windows CE, and Diamond Systems’ Universal Driver programming software for the data acquisition circuitry.

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Quad- and Dual-Core Processors

Intel Corporation (Santa Clara, CA) has released new processors with extended seven-year lifecycle support, a new chipset, and a carrier-grade server. The processors are based on Intel’s high-k, metal gate transistor formula and manufactured on the company’s 45-nanometer process. The processors include the Quad-Core Intel® Xeon® processor 5400 Series and the Dual-Core Intel "Xeon" processor 5200 series.

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New Embedded Form Factor

Congatec AG (Deggendorf, Germany) and SECO (Arezzo, Italy) have jointly created a new form factor for embedded computing. The Qseven format will complement the low power and small size of next-generation embedded processors built using 45nm technology. The Qseven format offers high-performance computing power delivered in a board measuring just 70mm × 70mm

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Networked Intelligent Display and Serial-to-Ethernet Modules

Luminary Micro (Austin, TX) has released communications modules and reference design kits for Ethernet-enabled display applications and serial- to-Ethernet communications applications. The compact networked Intelligent Display Module (MDL-IDM) offers a complete graphical touch-screen user interface solution for control, automation, and instrumentation. Featuring a 2.8-in. QVGA 16-bit color LCD resistive touch panel display and a Power- over-Ethernet (PoE) capability, the Stellaris MDLIDM offers a simple method to produce intelligent terminals that can be simultaneously powered and network-connected by a single CAT5 Ethernet cable. The module can also be powered with a standard 24 V DC power supply or through 5 V DC terminals.

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Separation Kernel and Embedded Hypervisor

LynuxWorks (San Jose, CA) unveiled the LynxSecure 2.0, its next-generation separation kernel and embedded hypervisor. LynxSecure 2.0 virtualizes the underlying hardware to enable multiple different operating systems (OS) to co-exist on the same platform. Consolidating heterogeneous OS environments reduces hardware costs and allows for easier reuse of legacy software.

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Potting and Encapsulation UV Adhesive

Master Bond (Hackensack, NJ) has introduced Master Bond UV10SP-2A, a one-component, flexible, UV curable polymer system for bonding, sealing, and coating with an attractive balance of pertinent physical, electrical, and chemical properties. The 100% reactive, moderate viscosity liquid at ambient temperatures does not contain any solvents or other volatiles. When exposed to a UV light source, Master Bond Polymer System UV10SP-2A cures as a durable, tough, non-yellowing system that can be used as an adhesive, sealant, and coating.

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CompactPCI Camera Link Frame Grabber

Active Silicon (Chelmsford, MA) has released the Phoenix D48CL-3CPCI32, a conduction-cooled, 3U CompactPCI Camera Link frame grabber. Designed for extremely rugged environments, the Phoenix operates in temperatures of -40 °C to +85 °C. The board is suitable for harsh environments found in industrial, military, and aerospace applications. The Phoenix D48CL-3CPCI32 utilizes rear panel I/O and supports the 32-bit/66MHz CompactPCI bus. The Camera Link interface encompasses dual Base/single Medium configurations, including PoCL cameras at 60MHz pixel clock rates.

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