Features

In-Line Inspection

The VT-S700 in-line automated optical inspection system from Omron Electronics, Schaumburg, IL, shortens tact time of soldered component inspection with an expanded field of view. Using a telecentric lens with a 2-megapixel camera, the system reduces image distortion at the edges of the field of view. It delivers high-resolution inspection of up to 10 microns for components as small as .01005, and down to a 12-mil pitch. The system uses a three-color highlight system that illuminates the printed circuit board in a 360-degree dome. The 3-CCD camera enhances solder shape recognition accuracy and identifies lead-free solder joints. Auto-teaching modes automatically extract components based on model pattern data, and logic customization allows the system to adapt to future changes in component shapes and solder types. Optical character verification capability is available, and resolution can be selected for 10, 15, or 20 microns.

Posted in: Products, Imaging

Read More >>

Network Cameras

Panasonic, Secaucus, NJ, has introduced two IP network cameras, the BL-C101A and BL-C121A that monitor from a PC or cell phone. The BL-C101A features one-wire, plug-and-play installation; the BL-C121A is wireless and features IEEE 802.11 operation with an internal antenna. Both cameras can simultaneously capture MPEG-4 video and JPEG images, and include a free Web address from which users can remotely monitor the camera’s video. Both cameras have a built-in microphone. Other features include digital input for camera triggering, full-screen monitoring, image transfer by motion detection/timer, and 4-up, 9-up, and 16-up multi-camera pages.

Posted in: Products, Imaging

Read More >>

Image Sensors

Banner Engineering Corp., Minneapolis, MN, offers the iVu series image sensors that combine a photoelectric sensor and a vision sensor. They feature a touchscreen with intuitive interface and configurable inspection parameters. Three sensor types are offered in one rugged package for applications such as injection molding verification, label inspection, packaging verification, weld nut orientation, and electronic marking verification.

Posted in: Products, Imaging

Read More >>

Moisture Release Technologies

A company seeks technologies enabling a woven or nonwoven substrate to contain liquid/fluid that can be released by applying pressure (to yield a moist/wet substrate). They are interested in solutions that will enable water or other liquids/ fluids to be contained within a substrate and then released under moderate pressure (for example, by squeezing the substrate in your hand). The technology solution must be able to incorporate sufficient liquid content in the substrate so that when pressure is applied, approximately 75% of that substrate unit becomes moist. Respond to this TechNeed at: www.techbriefs.com/tn/200906c.htmlEmail: nasatech@yet2.com Phone: 781-972-0600

Posted in: NASA Tech Needs, Tech Needs

Read More >>

Binder Solutions for the Manufacture of Molds and, Cores in Metal Castings

Binders used for molding are typically self-setting, so that after mixing two or more binder components into sand, there is a short delay before the mixture starts to set hard. Binders used for core-making are typically gas-cured. A company seeks an environmentally acceptable binder system that could be based on inorganic, “clean” organic, or hybrid derivatives, and offers an immediate advantage over current systems in terms of health, safety, and environmental issues. Respond to this TechNeed at: www.techbriefs.com/tn/200906d.htmlEmail: nasatech@yet2.com Phone: 781-972-0600

Posted in: NASA Tech Needs, Tech Needs

Read More >>

NASA Announces 2008 Inventions of the Year

Ames Research Center (Moffett Field, CA) and Langley Research Center (Hampton, VA) have won the 2008 NASA Government and Commercial Invention of the Year Awards, respectively. The Ames invention is a high-speed 3D laser scanner with real-time processing. Langley’s method for making highperformance resins for infusion and transfer molding processes is used in a high-temperature resin called PETI-330.

Posted in: Articles

Read More >>

Protecting Data Signals Through Isolation

Many of us believe that if we don’t have ground loops we don’t need to isolate analog I/O signals. Yet there are five very real – and very different – reasons to isolate every one of your analog signals! If you’ve had problems on past applications, chances are you experienced one of the following: Signal crosstalk Common-mode voltage DC common-mode rejection AC common-mode rejection Over-range and input protection issues. Isolating power sources and sensor signals is the most effective way to address these problems; understanding how measurement inputs become corrupted in the first place will illustrate this.

Posted in: Articles

Read More >>

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.