Imaging

Infrared Camera

FLIR Systems (Portland, OR) has released its SC6800 infrared camera. The device captures sensitive infrared imagery at up to 565 frames per second, in full 640 × 512 pixel resolution. The images can be thermographically and radiometrically calibrated.

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3D Machine Vision Inspection

Cognex Corporation (Natick, MA) has announced the DS1000 3D laser profiling system. The system calibrates real-world units of measurement for inspections too difficult to perform with traditional two-dimensional machine vision. The new DS1000 3D sensor reads embossed or raised characters, such as those on automobile tires; verifies the presence of low-contrast items in boxes or packages; identifies surface defects and chips; measures heights and tilts of components to determine misalignment; and calculates volumes and dimensions for food portioning. The DS1000 system is integrated with VisionPro® 3D software. VisionPro allows users to add GigE cameras for 2D inspection tasks. DS1000 is an integrated technology; a Cognex proprietary high-speed sensor and laser are both enclosed in an IP65-rated industrial housing.

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3D Machine Vision Camera

IDS Imaging Development Systems (Woburn, MA) offers a new stereo 3D camera: the Ensenso ™ N10. The Ensenso™ N10 is fitted with two global shutter CMOS sensors and a pattern projector that projects a static, high-contrast texture onto the object being captured, adding structures that are not visible or are only faintly visible to the human eye.

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Camera Board

e-con Systems (St Louis, MO) has released the Full HD MIPI Camera Board, e- CAM51_44×, for Texas Instruments’ OMAP4 family of processors. The e-CAM51_44× camera board is interfaced to the PandaBoard, which is based on the OMAP4430/ OMAP4460 processor. e-CAM51_44× includes e-CAM57_MI5640_MOD, a 5 MP autofocus MIPI CSI-2 camera module. A 70- mm flex cable provides flexibility in enclosure design as the module can be placed as far as 100 mm from the processor interface.

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CMOS/CCD Camera

The Imaging Source (Charlotte, NC) has announced monochrome and color FireWire 800 cameras. The cameras have an Aptina CMOS or Sony CCD sensor, 1/4'' to 1/1.8''. Other features of the 29 × 29 × 47 mm devices include resolution from VGA to 5 MP; frame rate up to 150 fps; binning and ROI; and trigger and digital I/Os.

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PoE Switch

D-Link (Fountain Valley, CA) has introduced the DGS- 1100-08P switch. The DGS- 1100-08P delivers Power-over- Ethernet (PoE) capabilities for IP surveillance, VoIP phone, and access point deployment.

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Micro-Endoscope as Thin as a Human Hair

Single fiber endoscope increases resolution fourfold over previous similar devices. Engineers at Stanford University have developed and demonstrated a prototype single-fiber endoscope that, they say, quadruples the resolution over existing designs, which might lead to the development of needle-thin, minimally invasive endoscopes able to view features out of reach of today’s instruments.

Posted in: Bio-Medical, Imaging & Diagnostics, Monitoring & Testing, Electronics, Optics/Photonics, Imaging, Photonics, Fiber Optics, Optics, Medical, Diagnostics, Briefs, MDB

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New Material Enables Improved Ultrasound

Ultrasound technology could soon be improved to produce high-quality, high-resolution images, thanks to the development of a new key material by a team of researchers in the Department of Biomedical Engineering at Texas A&M University, College Station.

Posted in: Bio-Medical, Imaging & Diagnostics, Optics/Photonics, Imaging, Optics, Materials, Metals, Medical, Patient Monitoring, Diagnostics, Nanotechnology, Briefs, MDB

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Building an Immersive Training Platform for Infantry Soldiers

Developing an effective immersive training tool requires a fine balance of technology capabilities with human factors. Achieving a training goal to build squad leadership skills, squad-level communication, and mission rehearsal for an entire squadron brings together several components, including advanced body sensors that must translate physical movements, avatar actions, and high-resolution headmounted displays (HMDs) to immerse the user in the virtual world.

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Modular Software & Metallography: Automating the Analysis Process

Today’s micro-imaging analysis software systems provide users with a module-based approach that allows imaging and measurement to be customized to specific workflow environments. This type of interface flexibility also enables higher levels of automation and standardization — facilities no longer need to rely on small groups of microscopy experts to handle their imaging and analysis tasks. Today, guided, automated functionality based on specific software modules allows larger numbers of staff members to manage the creation, analysis, and distribution of material images. These modules are particularly useful in metallography applications, guiding users through every step of the image analysis process.

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