Imaging

Spherical Imaging System

Point Grey Research (Richmond, BC, Canada) has announced its Ladybug ®5 camera. The LD5-U3-51S5C features 30 megapixels (MP) of total resolution, covering 90% of a full sphere; a 5Gbit/s USB 3.0 interface; and a post-processing workflow.

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Frame Grabbers

VRmagic (Mannheim, Germany) has introduced the VRmDAVC-2, an intelligent version of the company’s USB frame grabber. In combination with analog cameras, the frame grabber provides users with a platform that performs image processing tasks autonomously.

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Imaging Objectives

Edmund Optics® (Barrington, NJ) offers Mitutoyo Glass Thickness-Compensated Infinity Corrected Objectives. The components are suited for imaging objects through glass up to 3.5 mm thick. Applications for the G Plan Apochromatic (Apo) objectives include imaging through a coverslip or mediums like agar, water, or nutrients; inspecting LCDs, semiconductor, or flatscreen TV monitors; or imaging into a vacuum. Available in 20× and 50× magnifications, Mitutoyo Glass Thickness- Compensated Infinity Corrected Objectives feature color reproducibility and a flat image surface over the entire field of view.

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Infrared Camera

FLIR Systems (Portland, OR) has released its SC6800 infrared camera. The device captures sensitive infrared imagery at up to 565 frames per second, in full 640 × 512 pixel resolution. The images can be thermographically and radiometrically calibrated.

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3D Machine Vision Inspection

Cognex Corporation (Natick, MA) has announced the DS1000 3D laser profiling system. The system calibrates real-world units of measurement for inspections too difficult to perform with traditional two-dimensional machine vision. The new DS1000 3D sensor reads embossed or raised characters, such as those on automobile tires; verifies the presence of low-contrast items in boxes or packages; identifies surface defects and chips; measures heights and tilts of components to determine misalignment; and calculates volumes and dimensions for food portioning. The DS1000 system is integrated with VisionPro® 3D software. VisionPro allows users to add GigE cameras for 2D inspection tasks. DS1000 is an integrated technology; a Cognex proprietary high-speed sensor and laser are both enclosed in an IP65-rated industrial housing.

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3D Machine Vision Camera

IDS Imaging Development Systems (Woburn, MA) offers a new stereo 3D camera: the Ensenso ™ N10. The Ensenso™ N10 is fitted with two global shutter CMOS sensors and a pattern projector that projects a static, high-contrast texture onto the object being captured, adding structures that are not visible or are only faintly visible to the human eye.

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Camera Board

e-con Systems (St Louis, MO) has released the Full HD MIPI Camera Board, e- CAM51_44×, for Texas Instruments’ OMAP4 family of processors. The e-CAM51_44× camera board is interfaced to the PandaBoard, which is based on the OMAP4430/ OMAP4460 processor. e-CAM51_44× includes e-CAM57_MI5640_MOD, a 5 MP autofocus MIPI CSI-2 camera module. A 70- mm flex cable provides flexibility in enclosure design as the module can be placed as far as 100 mm from the processor interface.

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CMOS/CCD Camera

The Imaging Source (Charlotte, NC) has announced monochrome and color FireWire 800 cameras. The cameras have an Aptina CMOS or Sony CCD sensor, 1/4'' to 1/1.8''. Other features of the 29 × 29 × 47 mm devices include resolution from VGA to 5 MP; frame rate up to 150 fps; binning and ROI; and trigger and digital I/Os.

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PoE Switch

D-Link (Fountain Valley, CA) has introduced the DGS- 1100-08P switch. The DGS- 1100-08P delivers Power-over- Ethernet (PoE) capabilities for IP surveillance, VoIP phone, and access point deployment.

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Micro-Endoscope as Thin as a Human Hair

Single fiber endoscope increases resolution fourfold over previous similar devices. Engineers at Stanford University have developed and demonstrated a prototype single-fiber endoscope that, they say, quadruples the resolution over existing designs, which might lead to the development of needle-thin, minimally invasive endoscopes able to view features out of reach of today’s instruments.

Posted in: Bio-Medical, Imaging & Diagnostics, Monitoring & Testing, Electronics, Optics/Photonics, Imaging, Photonics, Fiber Optics, Optics, Medical, Diagnostics, Briefs, MDB

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