Imaging

Packaging Inspection Technology

Rudolph Technologies, Inc. (Wilmington MA) recently unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed to operating conditions for extended periods.

Posted in: Products, Cameras, Imaging

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Inside NASA’s White Sands Test Facility: How High-Speed Cameras Support Hypervelocity Experiments

At NASA’s White Sands Test Facility, Donald Henderson and his team spend much of their days shooting projectiles at 15,700 miles per hour. Hypervelocity testing done at the Las Cruces, NM center simulates the impact of micrometeoroids and orbital debris on spacecraft shields.

Posted in: Articles, Cameras, Imaging, Photonics

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Choosing the Right Adhesive for Display Bonding

When ambient light hits displays, it causes unwanted reflections, which adversely affects readability. This is a nuisance for users; however, it can be prevented with optical adhesives.

Posted in: Application Briefs, Imaging, Optics, Photonics

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Making Great Strides: Gaming Camera Improves MS Gait Assessment

Even university researchers play Xbox from time to time. Not all mechanical engineers, however, have the idea to use the popular gaming console’s camera to assist doctors in clinical applications.

Posted in: Application Briefs, Cameras, Diagnostics, Medical, Patient Monitoring

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Researchers Propose Modular Space Telescope

Researchers from California Institute of Technology are proposing the idea of a modular space telescope that could be assembled by robots. The space observatory would have a primary mirror with a diameter of 100 meters — 40 times larger than the Hubble Space Telescope.

Posted in: News, Imaging, Optical Components, Optics

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Introduction to Machine Vision Inspection

Product inspection with machine vision is vastly superior to manual inspection or using photoelectric sensors. With some basic knowledge and tools you can create a reliable, repeatable inspection process that will make your production line safer and more efficient. Download the whitepaper to learn how to dramatically improve production performance with easy-to-apply inspection applications.

Posted in: White Papers, Imaging, Machine Vision, Machinery & Automation, Robotics

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Thermal Camera

The T1030sc thermal imaging camera from FLIR Systems (Wilsonville, OR) features hardware, software, and a 1024 × 768 HD-IR detector. High-fidelity images are created using FLIR’s OSX™ Precision HDIR optics, which include an ultrasonic autofocus capability.

Posted in: Products, Cameras, Manufacturing & Prototyping

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Ultrasonic Piezo Motor Drives

Precision motion and nanopositioning systems specialist PI (Physik Instrumente) L.P. (Auburn, MA) recently released the smallest member in their miniature rotary stage series with ultrasonic piezo motor drives. The U-622 is joining two other high dynamics miniaturized ultrasonic rotary positioners, U-624 and U-628. Vacuum compatible versions to 10-6 hPa are available.

Posted in: Products, Imaging, Manufacturing & Prototyping, Photonics

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Frame Grabber

The FireBird Camera Link Deca board frame grabber from Active Silicon (Iver, UK) is now available in two form factors: a full-height version with front panel IO and a low-profile/half-height version. The low-profile design allows the FireBird Low Profile board to be used in small embedded PC enclosures and rack-mount cases where full-height PC cards are not suitable. A full-height bracket option is available for use in standard PC form-factor enclosures.

Posted in: Products, Imaging, Manufacturing & Prototyping, Photonics

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CMOS Cameras

SMARTEK Vision (New London, CT) offers the “twenty-nine” series of CMOS machine-vision cameras. Distributed by FRAMOS Technologies (Ottawa, Ontario, Canada), the 29 x 29- mm camera line fits GigE Vision and USB3 Vision with a high-speed sensor front-end into a miniature housing. Pixel sizes range from 5.86 μm and 3.45 μm down to 1.25 μm; sensor formats range from 1/2" to 1/3". The camera connects with C-Mount, Power-over-Ethernet (PoE), and general-purpose IOs (GPIO) via a 6-pin Hirose component.

Posted in: Products, Cameras, Manufacturing & Prototyping

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