Manufacturing & Prototyping

Welding Simulator

The Gleeble Welding Simulator from Dynamic Systems, Poestenkill, NY, provides a complete platform for welding simulations and testing capabilities, including weld HAZ simulation, crack susceptibility, and nil-strength determination. The servo system is capable of 200 millimeters per second stroke rate, and the high-speed thermal system offers heating rates up to 10,000 °C/second. The system provides the ability to reproduce a variety of thermal profiles and gradients that materials undergo in actual processes. For Free Info Visit http://info.hotims.com/61057-110

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Plastic Enclosures

OKW Enclosures, Bridgeville, PA, offers PACONNECT compact plastic enclosures for wired applications. The cases are offered in three sizes and consist of two case shells that are snapped together. Either end can be fitted with the accessory cable glands or plastic end panels, which can be machined for USB connectors, etc. For Free Info Visit http://info.hotims.com/61057-111

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Prototyping Platform

Avnet, Phoenix, AZ, released the ONIXVU440 flexible platform based on the Xilinx Virtex® UltraScaleTM XCVU440 FPGA. The board is designed for rapid prototyping and ASIC emulation of high-performance, highcomplexity systems. It supports three modes of operation: desktop standalone mode, PCIe plug-in card mode, and mezzanine module mode. For Free Info Visit http://info.hotims.com/61057-109

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Spring Connectors

Harwin, Salem, NH, offers Spring Contact Connectors including extended C and Positive Stop models in nine heights that maintain a positive force against a mating surface. They are available in different widths for a choice of spring contact forces, and offer “positive stop” to prevent damage caused by over-compression. They feature gold-plated contacts and current rating up to 1.0A, and can withstand up to 10,000 mating cycles. For Free Info Visit http://info.hotims.com/61057-112

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Made in Space: 3D Printing in Zero-G

NASA’s In-Space Manufacturing (ISM) project is responsible for developing the manufacturing capabilities that will provide on-demand, sustainable operations during NASA long-duration missions to destinations such as Mars. The very first step in the initial part of ISM was getting the first 3D printer into space. A 3D printer had never flown in space until the 3D Printing in Zero-G experiment was launched on SpaceX-4 on September 21, 2014. This demonstration was the first attempt to test the effects of microgravity on additive manufacturing in space. The printer was designed and built by Made in Space under a NASA Small Business Innovation Research (SBIR) contract. Learn how NASA and Made In Space worked together to design, develop, and deploy the printer, and how they are taking the next steps to create an Additive Manufacturing Facility in space.

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Stable, Flat Packaging Concepts for Large Detector Arrays

Applications include packing of back-illuminated and delta-doped arrays without damage to sensitive surfaces. NASA’s Jet Propulsion Laboratory, Pasadena, California A ceramic vacuum chuck is used to hold large detector arrays flat while being attached parallel to a rigid substrate. Once held in the vacuum chuck, the component is typically seized by epoxy against a rigid substrate. The problem that interferes with this operation happens when the epoxy spreads to places where it is not wanted, even into the gap between the component and its vacuum chuck, and over electrical contacts that are intended for wire bonding.

Posted in: Briefs, TSP

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Dual-Polarized W-Band Metal Patch Antenna Element for Phased Array Applications

Interlaced transmit/receive all-metal patch elements eliminate the need for discrete isolators and increase efficiency. NASA’s Jet Propulsion Laboratory, Pasadena, California W-band active phased array antennas have a very small inter-element pitch (≈2 mm). In this innovation, instead of trying to integrate isolators into the unit cell to separate transmit and receive signals, an interlaced triangular grid of metal patch elements has been developed. The isolation between transmit elements and receive elements has been demonstrated to be on the order of 25 dB or more, precluding the need for discrete isolator circuits. Using metal patch technology, the element and associated interconnect loss has been demonstrated to be 0.5 dB at 94 GHz, which represents an efficiency of 89%.

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