Manufacturing & Prototyping

Robust, High-Temperature Containment Cartridges for Microgravity

Other potential applications include chemical processing, heat pipes, power generation equipment, nuclear components, and automotive.Robust, high-temperature containment cartridges are needed for processing materials science experiments in microgravity. In general, the refractory metals (Nb, Ta, Mo, W, Re) possess the chemical inertness and high melting temperatures desired. Of these materials, niobium and tantalum alloys have been the materials of choice due to their low ductile to brittle transition temperatures, which allow deep-draw forming into cylindrical shapes. The high cost of tantalum and niobium, along with the desire for cartridges resistant to molten zinc and usable to 1,500 °C, demonstrates the need for alternative cartridge materials. Two candidate materials are molybdenum and tungsten alloys. Both have high melting temperatures and cost an order of magnitude less than tantalum and niobium.

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Method for Insertion of Carbon Fiber Through the Thickness of Dense Dry Fiber Preform

Heat shields for re-entry vehicles, and jet engine exhaust components are two potential applications. Ames Research Center, Moffett Field, California Creation of a structural joint for a heat shield for extreme entry environments requires structural fibers penetrating through the thickness of the shield at joint locations. The structural fibers must be made of carbon to withstand extremely high temperatures, i.e. 2000 ºC. Carbon fibers, due to their relatively high modulus (stiffness), are easily damaged and broken when handled by a conventional sewing machine. Special coatings such as nylon are required to increase the durability of the fiber to enable its use in a sewing or tufting process.

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Edge-Bonded Shims

Edge-bonded shims reduce assembly time and require less inventory storage space. SPIROL International Corp., Danielson, Connecticut Precision shims are used as compensators to absorb tolerances between mating components. They significantly reduce manufacturing costs by eliminating the need for each component to be precision-machined in order to achieve the proper fit and function of the total assembly. During the assembly process, shims provide adjustment to compensate for accumulated tolerances that significantly reduces the need for re-machining and assembly time. Additionally, shims are commonly used to preserve the faces between mating components, cutting down the required machining time during rebuilds/retrofitting.

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Precision Detector Conductance Definition via Ballistic Thermal Transport

This innovation could be applied in the development of bolometric detector array sensors. Goddard Space Flight Center, Greenbelt, Maryland The characteristics of a thermal detector, such as sensitivity, response time, and saturation power (or energy resolution), are functions of the thermal conductance of the detector to its cryogenic environment. The thermal conductance is specified to achieve a tradeoff among the highest sensitivity, allowed response time, and the desired saturation energy or power budget for the particular application. It is essential to achieve the design thermal conductance (within an acceptable variance) after a thermal detector has been fabricated. Otherwise, the detector will fail to achieve its desired functionality. In addition, the formation of a multi-pixel imaging array becomes difficult and costly when the design thermal conductance is not achieved with high post-fabrication yield.

Posted in: Briefs, TSP, Manufacturing & Prototyping, Sensors

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Thermal Spraying of Coatings Using Resonant Pulsed Combustion

This is a high-volume, high-velocity surface deposition of protective metallic and other coatings on surfaces. John H. Glenn Research Center, Cleveland, Ohio Thermal spray coating is not a new process. There are different techniques utilized that depend on the objective function of the coating, the environment to which the coated piece will be subjected, and the coating material used. In any application, quality is ultimately measured by how well the coating material adheres to the sprayed surface. This, in turn, is controlled by the velocity at which the coating material impinges on the substrate, the size of the molten coating particles, and the degree to which the coating material is prevented from chemically reacting while in a molten state.

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Plasma Treatments to Assist Fluid Manipulation in Microgravity

Altering the surface energy of container walls permits anchoring of fluids within the container. Lyndon B. Johnson Space Center, Houston, Texas A recent innovation has made manipulation of hazardous laboratory reagents in microgravity easier, thus enabling even more scientific research to be performed on the International Space Station (ISS). Prior to this innovation, moving fluids from container to container was performed only under conditions of redundant and physically separate layers of containment. This design paradigm restricts access to — and direct manipulation of — fluids in microgravity conditions.

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Stencil-less Jet Printing for PCB Assembly

Solder paste inkjet is an inline, solder-mask printing technology that enables 3D printing of different thicknesses of solder paste for prototype PCBs. Imagineering Inc., Elk Grove Village, Illinois For many years, stencil printing has been the standard method of depositing solder paste on surface mount assembly printed circuit boards (PCBs). It has provided a durable method of applying solder paste, but there were always difficulties that significantly slowed down a change from one product to another in the assembly operation, and added cost. A significant challenge in newer, smaller electronics assembly is the huge difference in size among components. Therefore, trying to apply the right amount of solder paste for each component with one stencil is difficult. The biggest problem is how to produce quick-turn prototypes without disrupting series production that is already running in the line. Product changeover requires time-consuming tweaks to the stencil printing process, while unnecessarily shutting down an expensive assembly line to change the product. The inability of the stencil’s technology to vary solder paste volume by part, on the run, remains the biggest impact on the soldering quality.

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