Manufacturing & Prototyping

Stable, Flat Packaging Concepts for Large Detector Arrays

Applications include packing of back-illuminated and delta-doped arrays without damage to sensitive surfaces.

NASA’s Jet Propulsion Laboratory, Pasadena, California

A ceramic vacuum chuck is used to hold large detector arrays flat while being attached parallel to a rigid substrate. Once held in the vacuum chuck, the component is typically seized by epoxy against a rigid substrate. The problem that interferes with this operation happens when the epoxy spreads to places where it is not wanted, even into the gap between the component and its vacuum chuck, and over electrical contacts that are intended for wire bonding.

Posted in: Briefs, TSP, Manufacturing & Prototyping, Fastening, Packaging, Ceramics

Dual-Polarized W-Band Metal Patch Antenna Element for Phased Array Applications

Interlaced transmit/receive all-metal patch elements eliminate the need for discrete isolators and increase efficiency.

W-band active phased array antennas have a very small inter-element pitch (≈2 mm). In this innovation, instead of trying to integrate isolators into the unit cell to separate transmit and receive signals, an interlaced triangular grid of metal patch elements has been developed. The isolation between transmit elements and receive elements has been demonstrated to be on the order of 25 dB or more, precluding the need for discrete isolator circuits. Using metal patch technology, the element and associated interconnect loss has been demonstrated to be 0.5 dB at 94 GHz, which represents an efficiency of 89%.

Posted in: Briefs, TSP, Manufacturing & Prototyping, Antennas, Metals

High-Temperature Superconducting Bolometric Devices on Amorphous Silicon Nitride Membranes

Applications include defense-related infrared launch detection and night vision.

NASA’s Jet Propulsion Laboratory, Pasadena, California

There has been a great deal of interest in building bolometers from hightemperature superconductors due to their high transition temperatures and the associated ease of cooling. High-temperature superconducting (high Tc) bolometers are difficult to fabricate because the standard method of thermal isolation is not compatible with these materials. A method is described that allows a standard thermal isolation technique (using amorphous silicon nitride membranes) to be used with high-temperature superconductors.

Posted in: Briefs, Manufacturing & Prototyping, Fabrication, Conductivity

Uniformly Etched Lateral Gratings Applied to Pre-existing Ridge Waveguides

New technology is 100 times smaller and has fewer components with possibly the same performance.

NASA’s Jet Propulsion Laboratory, Pasadena, California

There is great difficulty in implementing lateral gratings in GaSb-based lasers. Commercially, single-frequency GaSb lasers have been fabricated using metal gratings deposited laterally to the ridge-waveguide (RWG) stripe. The disadvantage of this is that the laser performance is compromised by additional optical loss due to radiation absorption by the metal. Fabricating lasers in this way limits the potential for high-power performance. A better method is to etch gratings into the semiconductor, but generally, patterning these grating structures is difficult because of nonuniformity of the grating pattern and etching difficulty due to sub-micrometer dimensions.

Posted in: Briefs, TSP, Manufacturing & Prototyping, Waveguides, Fabrication, Metals

High-Precision Thin Film Metal Liftoff Technique

This process can be used by industries that need to fabricate microelectronic devices and superconducting sensors.

Goddard Space Flight Center, Greenbelt, Maryland

The objective of this work was to develop a thin film metal liftoff process that would allow one to accurately pattern two-micron-wide (or wider) features. The goal of this innovation was to pattern thin metal films on silicon substrates. The thin metal films can be deposited using physical vapor deposition techniques. The metallic films to be lifted off were deposited via DC magnetron sputtering, in which the mean free path of the metal atoms to be deposited is on the order of one micron. Thus, the deposited metal could conformally coat structures to fill in gaps that were greater than approximately one micron tall.

Posted in: Briefs, TSP, Manufacturing & Prototyping, Coatings, colorants, and finishes, Metals, Polymers

Process for 3D Printer Filament Fabrication

Marshall Space Flight Center, Alabama

Conventional filament extrusion processes are unsuitable for recycling materials on the International Space Station due to requirements for continuous monitoring and tuning, as well as poor filament dimensional control. The Positrusion process recycles scrap or waste thermoplastics into filament for 3D fused filament fabrication (FFF) printers.

Posted in: Briefs, Manufacturing & Prototyping, Recycling, Fabrication, Plastics

Products of Tomorrow: December 2015

The technologies NASA develops don’t just blast off into space. They also improve our lives here on Earth. Life-saving search-and-rescue tools, implantable medical devices, advances in commercial aircraft safety, increased accuracy in weather forecasting, and the miniature cameras in our cellphones are just some of the examples of NASA-developed technology used in products today.

Posted in: Articles, Products, Manufacturing & Prototyping, Imaging and visualization, Medical, health, and wellness, Commercial aircraft

Product of the Month: December 2015

Keysight Technologies, Santa Rosa, CA, introduced series E36100 compact DC power supplies that offer LAN and USB interfaces and reliable power for testing and validating designs. Five models feature up to 100 V or 5 A output. Design and validation engineers can use the supplies to power devices under test (DUTs) during manual tests or automated sequences. The devices’ compact form factor (2U, ¼-rack) enables use on a bench or in a rack, and standard LAN (LXI Core) and USB interfaces connect the power supplies to a computer. An intuitive on-screen menu system enables users to perform manual tasks quickly, and overvoltage and overcurrent detection protects DUTs. Each of the five models comes standard with measurement capability for very small currents, a high-contrast OLED display enabling users to view the screen from anywhere, low noise power, overvoltage and overcurrent load protection, front and rear output terminals, and USB control.

For Free Info Visit

Posted in: Products, Aerospace, Manufacturing & Prototyping

Imaging Software

ARM-based Z series Smart Cameras from Vision Components (Ettlingen, Germany/ Hudson, NH) are now available with HALCON Embedded software. The software features an integrated development environment and a comprehensive library for blob analysis, morphology, matching, measuring, and identification.

Posted in: Products, Imaging, Manufacturing & Prototyping

CMOS Cameras

The Imaging Source (Charlotte, NC) has announced new industrial cameras equipped with the Sony Full HD WDR Sensor IMX174. The cameras are available as GigE (PoE) and USB 3 versions in monochrome and color. At full HD, the devices achieve a maximum frame rate of 54 fps; at VGA resolution up to 120 fps. Barcode software, for on-screen measurement and image capture, is included. Other features: integrated HDR/WDR (High/Wide Dynamic Range); C/CS- or S-Mount; and drivers for LabView, HALCON, MERLIC, VisionPro, DirectX, Twain, and NeuroCheck.

For Free Info Visit:

Posted in: Products, Imaging, Manufacturing & Prototyping

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