Materials

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

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Reliability Testing of GORE® Protective Vents in Telecommunication Enclosures

Premature failure of telecommunication equipment leads to network downtime, higher costs, increased maintenance and decreased brand loyalty. One of the most significant challenges for this equipment is withstanding the conditions of the environment in which it is installed.

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

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Achieving High Reliability SAC Solder Joints via Min Doping

In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys. SACM is a patent pending alloy consisting of 0.5-1% Ag, 0.5-1% Cu, <0.1% Mn. SACM alloy achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for many test conditions. More significantly, SACM matched SAC305 in thermal cycling performance. In other words, the low cost SACM achieved a better drop test performance than the low Ag SAC alloys, plus the desired thermal cycling reliability of high Ag SAC alloys. The mechanism for high drop shock performance and high thermal cycling reliability can be attributed to a stabilized microstructure, with uniform distribution of fine IMC particles, presumably through the inclusion of Mn in the IMC. The cyclic bending results showed SAC305 to be the best and all lead-free alloys were equal or superior to SnPb. The reliability test results also showed that NiAu is a preferred surface finish for BGA packages over OSP.

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Lubricant Selection: What Every Design Engineer Needs to Know

Simply stated, lubrication refers to the age-old science of friction reduction. People have been using lubricants for thousands of years, experimenting with waxes and oils from vegetables, fish, and animals to move heavy materials with equipment designed to gain mechanical advantage. In more recent years, the discovery of petroleum oil in the 1800s ushered in a new era of lubrication developments as people learned how to refine this oil and use it for a variety of purposes. Machinery could now be developed to operate faster and under heavier loads by using lubricants to create a barrier that eliminates friction and metalon- metal contact.

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UV-/Light-Curing Adhesives Improve Manufacturing Productivity

The manufacturing world is constantly looking for processes that can accelerate production while lowering unit costs and improving product reliability. Each innovation must mesh with the overall production process to achieve high output levels. Bonding processes should be capable of smoothly running in automated processes requiring short cycle times. UV and other light-curing adhesives, like those developed by DELO Industrial Adhesives, meet those criteria better than older adhesives and other joining solutions in a wide range of industrial applications. Without these fast-curing UV and other light-curing adhesives, it would not be possible to produce mobile phones, smart cards, embedded cameras, even shower enclosures, as we know them.

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