Semiconductors & ICs

In-House or Outsource – What’s the Right Choice for DO-254 Projects?

This paper examines the considerations of whether it is more cost effective to perform DO-254 development in-house or to outsource the work. It also provides additional factors to weigh when choosing an outsourcing firm.

Posted in: Semiconductors & ICs, White Papers

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Increasing Automotive Safety Through Embedded Radar Technologies

In response to a need for active and predictive safety systems within the automotive sector, semiconductor suppliers are developing innovative radar-based embedded solutions. These next-generation technologies present unique capabilities for designers of Advanced Driver Assistance Systems (ADAS), enabling life-saving safety features as well as compliance with the latest regulatory standards.

Posted in: Semiconductors & ICs, White Papers

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Optimum Fastener Selection for Internal Pumping in Vacuum Systems

The use of fasteners inside of vacuum chambers, while necessary for obvious reasons, can present a number of problems resulting from trapped volumes. Trapped volumes of gas, typically air trapped during assembly, within vacuum chambers are not easily found and can be difficult to pump out, often appearing later as “virtual leaks”. Fasteners also, due to their helix design, have a large surface area relative to their size, creating an un-exposed water-retaining surface. Fortunately there are optimal fastener configurations that address these issues.

Posted in: Semiconductors & ICs, White Papers

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Putting FPGAs to Work in Software Radio Systems

Recently updated, this handbook reviews the latest FPGA technology and how it can be put to use in software radio systems. FPGAs offer significant advantages for implementing software radio functions such as digital downconverters and upconverters. These advantages include design flexibility, higher precision processing, lower power, and lower cost.

Posted in: Electronics & Computers, Semiconductors & ICs, White Papers

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Future Advances in Body Electronics

With the ever-increasing levels of comfort, safety, efficiency and consumer features in vehicles, carmakers and their electronics suppliers must cope with the conflicting demands of electronics complexity versus power and weight. New MCU products with higher levels of integration, performance and connectivity will result in a total reduction of the number of components and wiring which will help reduce vehicle weight and thereby enable more efficient vehicles. Additionally, innovative low-power modes help reduce current consumption of the individual components as well as to facilitate a reduction in network power. This white paper explores the latest challenges for body electronics design and offers up innovative solutions for the applications in this segment.

Posted in: Semiconductors & ICs, White Papers

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White Papers

White Paper: Computer System Design for Critical Applications
Sponsored by Sealevel
Miniature SAW Filters for Automotive Telematics
Sponsored by EPCOS
Tubing & Hose Buying Tips, Part 2
Sponsored by Newage Industries
White Papers: Using FPGAs to Improve Embedded Designs
Sponsored by Sealevel
Looking at Ceramic Carbides in a New Light
Sponsored by Goodfellow
Oscilloscope Fundamentals
Sponsored by Rohde and Schwarz A and D

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