Semiconductors & ICs

Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

Posted in: Techs for License, Techs for License

Read More >>

White Papers

Determination of Capacitor Life as a Function of Operating Voltage and Temperature
Sponsored by Evans Capacitor
Inclinometers for Motion Control
Sponsored by Fraba Posital
Avoid the High Cost of Quality Failure
Sponsored by Arena Solutions
3D Printing with FDM: How it Works
Sponsored by Stratasys
Are you tired of maintaining UPS Systems?
Sponsored by Falcon
Uncooled Infrared Imaging: Higher Performance, Lower Costs
Sponsored by Sofradir EC

White Papers Sponsored By: