Semiconductors & ICs

Dual-Leadframe Transient Liquid Phase Bonded Power Semiconductor Module Assembly and Bonding Process

This module package and bonding process enable device operation at temperatures exceeding 400 °C. A high-temperature-capable widebandgap semiconductor power module package, coupled with a new high-temperature- capable bonding process (with an optimized assembly and manufacturing process), has been developed that, together, can allow device operation at temperatures exceeding 400 °C, with the potential for higher-temperature operation depending on the semiconductor device characteristics. The semiconductor module is an ultracompact, hybrid power module that uses double leadframes and direct lead-frame-to- chip transient liquid phase (TLP) bonding. The unique advantages include very high current-carrying capability, low package parasitic impedance, low thermomechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3 to 5× reduction in size and weight from the prior art, no failure-prone bond wires, and will be capable of operating from 450 to –125 °C.

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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Head-Mounted Display Embeds an Augmented Reality Chip

Researchers at the Korea Advanced Institute of Science and Technology (KAIST) developed K-Glass, a wearable, hands-free head-mounted display (HMD).Unlike virtual reality which replaces the real world with a computer-simulated environment, augmented reality (AR) incorporates digital data generated by the computer into the reality of a user. With the computer-made sensory inputs such as sound, video, graphics or GPS data, the user’s real and physical world becomes live and interactive. The AR processor has a data processing network similar to that of a human brain’s central nervous system. When the human brain perceives visual data, different sets of neurons, all connected, work concurrently on each fragment of a decision-making process; one group’s work is relayed to other group of neurons for the next round of the process, which continues until a set of decider neurons determines the character of the data. Likewise, the artificial neural network allows parallel data processing, alleviating data congestion and reducing power consumption significantly.   Source Also: Learn about a Volumetric 3D Display System with Static Screen.

Posted in: Semiconductors & ICs, News

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Flexible Microstrip Circuits for Superconducting Electronics

Improved wiring geometry should further reduce the size of the wiring while also reducing the crosstalk among wire pairs. Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (≈0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (≈0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving high-quality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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High-Temperature, Distributed Control Using Custom CMOS ASICs

Integrated circuits capable of operating at elevated temperatures are needed in applications including automotive control, turbine engine control, and downhole well logging systems. Four application specific integrated circuits (ASICs) that provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200 °C) environment were developed. The four ASICs are combined with a digital signal processor (DSP) to create a distributed control node. Patented circuit design techniques facilitate fabrication in a conventional 0.5-micron bulk complimentary metal oxide semiconductor (CMOS) foundry process.

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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Electron Beam Writer Enables Microfabrication

Integrated electronics could activate prosthetics. The new electron beam writer housed in the cleanroom facility at the Qualcomm Institute, previously the UCSD division of the California Institute of Telecommunications and Information Technology, is important for two major areas of research by Shadi Dayeh, PhD, an electrical and computer engineering professor. He is developing next-generation, nanoscale transistors for integrated electronics. At the same time, he is working to develop neural probes that can extract electrical signals from brain cells and transmit the information to a prosthetic device or computer. To achieve this level of signal extraction or manipulation requires tiny sensors spaced very closely together for the highest resolution and signal acquisition. Enter the new electron beam writer. (See Figure 1)

Posted in: Bio-Medical, Electronics, Implants & Prosthetics, Biosensors, Optics/Photonics, Electronics & Computers, Medical, Patient Monitoring, Semiconductors & ICs, Briefs, MDB

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Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

Posted in: Techs for License, Semiconductors & ICs

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In-House or Outsource – What’s the Right Choice for DO-254 Projects?

This paper examines the considerations of whether it is more cost effective to perform DO-254 development in-house or to outsource the work. It also provides additional factors to weigh when choosing an outsourcing firm.

Posted in: Semiconductors & ICs, White Papers

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White Papers

Force and Torque Measurement Traceability
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Epoxies and Glass Transition Temperature
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Comparison of Interface Pressure Measurement Options
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