Test & Measurement

Decomposition Technique for Remaining Useful Life Prediction

This invention has applications in electronic systems, mining, medical equipment, power generation, smart buildings, transportation vehicles, and industrial machinery. Ames Research Center, Moffett Field, California Technology has been developed that provides a way to compute the remaining useful life (RUL) of a component or system. The estimation of the RUL of a degraded or faulty component is at the center of condition-based maintenance, and prognostics and health management. It gives operators a potent tool in decision-making by quantifying how much time is left until functionality is lost. This is especially important for aerospace systems, where unanticipated subsystem or component failure may lead to failure of the system as a whole, which in turn may adversely affect the safety of operation.

Posted in: Briefs

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Strain Gage for Highly Elastic, Low-Modulus Materials

This gage surpasses conventional foil technology, measuring elastic strain range greater than 100 percent while reducing measurement error. Armstrong Flight Research Center, Edwards, California Researchers at NASA’s Armstrong Flight Research Center have developed and tested a new strain gage that makes significant strides in the state of the art, particularly salient given the requirements of new structural components on aerospace vehicles. Conventional foil technology presents a significant shortcoming for these vehicles, since it is limited to less than 20 percent strains while newer vehicles include highly elastic, low-Young’s-modulus materials that require higher strain measurements. For example, fabric-reinforced rubbers and elastomers have a nonlinear stressstrain relationship with extreme rupture strains — some greater than 500 percent.

Posted in: Briefs

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The Ultimate Tool for Characterizing Materials during Mechanical Tests and Validating FEA during Component Tests

Digital Image Correlation Technology (DIC) is a non-contact 3D measurement tool that measures deformation and strain during material testing. DIC is a single system that replaces strain gages, accelerometers, LVDT’s, string potentiometers, extensometers, laser trackers, and surface scanners. The results are full field, and presented as an experimental representation of a finite model.

Posted in: On-Demand Webinars

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Top 5 Trends in Product Development and Test Engineering

Take a look at this ebook and see how high-Tech OEMs are Improving Product Quality and the Bottom Line. Whether you are a product designer, engineer, or executive, learn more about Test Best Practices from Averna; what works, what doesn’t and what the trends are.

Posted in: White Papers

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Considerations for Choosing Temperature Measurement Devices

Temperature is the physical variable most often measured in industrial processes. Selecting the sensor and measurement device to match a specific process is extremely important, and knowing the various options is the first step to optimizing temperature measurement. There are a variety of reasons we need to know the temperature of an object or a process — to prevent product damage, ensure sterilization, determine biological health, ensure mixture blending, control chemical reactions, or ensure drying, curing, and outgassing, to name just a few. Temperature measurement can also be a regulatory requirement; for example, the Food and Drug Administration (FDA) requires temperature monitoring of food and drug products.

Posted in: Articles

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Accelerometers

PCB® Automotive Sensors Division (Depew, NY) offers MEMS DC response accelerometers for improving the precision of low-frequency vibration and motion in automotive applications. Available in full-scale ranges from ±2g to ±200g, the accelerometers come in single-axis (Series 3711E and Series 3741E) and triaxial (Series 3713E) configurations. The units include gas-damped, silicon MEMS sensing elements. Series 3711E and Series 3713E have a hermetically sealed titanium case, and Series 3741E units have a rugged anodized aluminum housing for harsh environments.

Posted in: Products

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Power Monitoring

Microchip Technology (Chandler, AZ) introduced the MCP39F511 single-phase power monitoring IC designed for real-time measurement of AC power. It is designed for use in high-performance commercial and industrial products such as lighting and heating systems, smart plugs, power meters, and AC/DC power supplies. To address industry requirements for better accuracy across current loads, additional power calculations, and event monitoring of various power conditions, the IC provides popular standard power calculations combined with advanced features. The import and export of active energy accumulation, four-quadrant reactive energy accumulation, zero-crossing detection, and dedicated PWM output have been integrated on-chip, along with the ability to measure active, reactive, and apparent power; RMS current and RMS voltage; line frequency; and power factor.

Posted in: Products

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