Features

Cooling Embedded Systems What Are The Options?

As the cooling challenges in embedded system applications have multiplied due to increased processing performance, smaller package and system footprints, and the requirement to operate in more rugged environments, new thermal management options and industry standards continue to evolve. Designers of systems for these markets, and especially those in remote or rugged, 24/7 operating environments, have always had to make difficult decisions regarding lifespan, reliability, and cost.

Posted in: Articles, Articles, Electronics & Computers, Embedded software, Embedded software, Cooling, Durability, Durability
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The Inner Workings of Solid State Flash: SLC versus MLC

Because all solid state flash products are not created equal and flash storage is finding its way into more and more embedded computing applications, system designers should understand the critical tradeoffs between competing technologies when evaluating flash products. Most commonly, the endurance and reliability required in end-user applications help dictate the appropriate storage technology to use. Two well-known flash storage technologies, Single Level Cell (SLC) and Multi Level Cell (MLC), offer distinct advantages, depending on a user’s needs.

Posted in: Articles, Articles, Electronics & Computers, Computer software / hardware, Computer software and hardware, Computer software / hardware, Computer software and hardware, Data management
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VITA 66 & 67 Bringing Fiber Optic and Mixed Signal Capability to VPX

Today’s rugged embedded computing industry demands the best of technology and reliability. Driven by requirements for higher performance solutions, platforms continually evolve. Standards organizations, such as the VSO (VMEbus Standards Organization), are diligently working to bring the technology for these solutions to the mainstream. The VSO’s VPX architecture, based on Tyco Electronics’ MULTIGIG RT2 backplane connector as qualified to the VITA 46.0 standard, is the latest technology to be applied to rugged embedded computing. In addition to dealing with escalating processing, power, and cooling requirements of leading edge solutions, the VSO is now addressing the need to realize high bandwidth and high fidelity transmission via alternative media — e.g. fiber optic and coaxial wave guides. This technology is crucial in realizing the full potential of today’s cutting edge C4ISR gear, including RF intensive radar, SIGINT and IED defeat gear, as well as systems benefiting from fiber optics, including secure, long distance and high data rate communications lines.

Posted in: Articles, Articles, Electronics & Computers
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Laser-Sintering 3D Manufacturing Made Simple

Laser-sintering has evolved significantly since its commercial introduction in the 1980s. Born out of the rise of rapid prototyping technology, laser-sintering is now the design-driven catalyst for global innovation in such industries as aerospace, medical device design, automotive and consumer.

Posted in: Articles, Lasers & Laser Systems, Photonics, Lasers, Lasers, Technical reference, Technical review, Additive manufacturing
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Dr. Luz Marina Calle, Lead Scientist and Principal Investigator, Corrosion Technology Laboratory, Kennedy Space Center

Dr. Luz Marina Calle earned her Ph.D. in chemistry from Ohio University and shortly thereafter became a professor of chemistry at Randolph College in Virginia. In 1989, she was selected to participate in NASA’s Summer Faculty Fellowship program at the Kennedy Space Center (KSC). Her summer work at KSC continued for a decade while performing her duties as professor and chair of the chemistry department at Randoph College. In 2000, Dr. Calle joined NASA permanently. She now leads NASA’s Corrosion Technology Laboratory at KSC.

Posted in: Who's Who
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Aircraft Modification and Integration Enables SOFIA to Fly

Aircraft and airborne system development and modification
L-3 Communications Integrated Systems
Waco, TX
254-799-5533
www.l-3com.com/is/

Posted in: Application Briefs, Aerospace, Optics, Optics, Performance upgrades, Fixed-wing aircraft
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Taking COTS to the Next Level in Vetronics Subsystems

Embedded vetronics (vehicle electronics) subsystems for rugged deployed ground vehicles have long benefited from the reduced risk, faster time to market, and long lifecycle support offered by COTS board vendors. Recent advances in open standards developments, namely the OpenVPX/VITA 65 specification that defines system-level interoperability profiles for VPX architecture boards and backplanes, promise to take the COTS model from the board to the subsystem level, enabling faster deployment of proven, standards-based fully integrated enclosures.

Posted in: Application Briefs, Application Briefs, Electronics & Computers, Architecture, Electronic equipment, Integrated circuits, Architecture, Electronic equipment, Integrated circuits
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Wafer-Level Lens Alignment

Over one billion cell phones with cameras are sold every year, and this number has been increasing annually at a rate of about 15 percent for the past 7 years. Approximately 80 percent of cell phones now have embedded cameras, with about 20 percent of new cell phones having two cameras – one on the back for taking photographs and one on the front for videoconferencing.

Posted in: Application Briefs, Imaging, Photonics, Calibration, Downsizing, Optics, Optics, Assembling
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NASA Reproduces a Building Block of Life in Laboratory

NASA scientists studying the origin of life have reproduced uracil, a key component of our hereditary material, in the laboratory. They discovered that an ice sample containing pyrimidine exposed to ultraviolet radiation under space-like conditions produces this essential ingredient of life. Pyrimidine is a ring-shaped molecule made up of carbon and nitrogen and is the basic structure for uracil, part of a genetic code found in ribonucleic acid (RNA).

Posted in: UpFront
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High Heat Pumping Thermoelectric Device

Nextreme Thermal Solutions (Durham, NC) introduces an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. The RoHS-compliant OptoCooler HV14 module is a high heat pumping thermoelectric device designed for standard electrical power requirements.

Posted in: GDM, Products, Products, Energy, Thermoelectrics
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