Connectivity Solutions - Keeping Pace with the Rapid Evolution of Embedded Computing Systems

Embedded Computing is seeing a rapid evolution in system design. New defense platforms and system upgrades are widely adopting open architecture standards like VPX in place of 20+ year old technologies. Defense-grade processors are now achieving 28Gbps data rates with significant I/O count, which drives increased functionality and enables computing hardware to shrink in size and weight.

Posted in: On-Demand Webinars, Defense, Electronics & Computers

Printed Electronics Primer: an Introduction to the Basics of Printed Electronics

This white paper provides an overview of how printed electronics (PE) can help you fit more functionality into smaller spaces, while maximizing cost efficiency. You will learn the basic terminology and gain an understanding of today’s PE industry, including prevalent technologies, materials and manufacturing processes.

Posted in: White Papers, Communications, Electronics & Computers, Medical

Products of Tomorrow: June 2017

This column presents technologies that have applications in commercial areas, possibly creating the products of tomorrow. To learn more about each technology, see the contact information provided for that innovation.

Posted in: Articles, Electronics, Materials, Plastics, Additive manufacturing, Elastomers, Materials properties, Plastics, Semiconductors

Recovering Metals from Electronic Waste

This process dissolves the major metals found in electronics, including materials that have been shredded, magnetically separated, or milled to a particle size less than one millimeter.

End-of-life electronic devices such as smartphones, computers, televisions, and other electronics contain significant amounts of valuable metals including base metals (zinc, tin, lead, nickel, and copper), precious metals (silver, gold, and palladium), and rare earth magnets (neodymium, yttrium, samarium). Some electronic scrap is currently landfilled or incinerated, and there is a need to develop more effective processes to capture these valuable metals along with keeping them out of the environment.

Posted in: Briefs, Electronics & Computers, Electronic equipment, Electronic equipment, Recycling, Metals, Waste materials

Solder Bond Packaging for High-Voltage Pulsed Power Devices

This invention is a superior switching component for pulsed power applications.

The huge demand for switching components exceeding silicon's (Si) current density limitation of 200 A/cm2 has pushed the enhancement of alternative semiconductor materials such as silicon carbide (SiC), gallium nitride, and diamond. The enhanced material properties of SiC, such as high thermal conductivity, large critical field, wide bandgap, large elastic modulus, and high saturation velocity, make it a viable candidate for pulsed power systems. Using SiC would increase both current and power densities, improve dI/dt and dV/dt capabilities, reduce recovery time, and minimize switching losses in various power electronic systems. Furthermore, a significant reduction in the volume and weight of pulsed power systems can be realized by implementing SiC SGTOs, reducing the thermal management requirements of the pulsed power system.

Posted in: Briefs, Electronics & Computers, Power electronics, Switches, Power electronics, Switches, Welding, Semiconductors

Virtual Fabrication and Assembly Documentation

Over the years, the term “virtual” has become associated with many different domains. Virtual machines are now commonplace as a substitute for physical laptops or desktops, allowing for the emulation of computer systems. Of course, virtual reality is in the news daily as new headsets, apps, and games provide a substitute for images and sounds, allowing for the simulation of a three-dimensional environment. In the printed circuit board (PCB) space, some fabrication and assembly information such as artwork, drill, netlist, test, and component placement have been conveyed virtually to manufacturing for more than 30 years.

Posted in: Articles, Electronics & Computers, Documentation, Assembling, Fabrication

Chip-Sized Terahertz Modulator for Faster Data Transmission

This modulator is suitable for THz transmitters/receivers on a single chip.

Tufts University engineers have invented a chip-sized, high-speed modulator that operates at terahertz (THz) frequencies at room temperature and at low voltages without consuming DC power. The discovery could transmit data at significantly higher speeds than currently possible.

Posted in: Briefs, Electronics & Computers, Electronic equipment, Wireless communication systems, Electronic equipment, Wireless communication systems, Energy consumption, Product development

Product of the Month: June 2017

Phoenix Contact, Middletown, PA, introduced VL2 1000 industrial PCs equipped with Intel® Atom™ Bay Trail processors that are available as box or panel PCs. The VL2 1000 includes a choice of 7", 9", 12.1", 15.6", 18.5", and 21.5" display sizes with capacitive-touch interface, allowing swiping, pinching, and multiple touch points at one time. An optional CAN module provides configurability for communication protocols. Other configuration options include memory, mass storage, operating system, and fieldbus. The PCs offer RAID 0/1 support, fanless design for industrial applications, HAZLOC approvals such as Class I Div. 2, and removable rotating or solid-state hard drives in a variety of sizes.

Posted in: Products, Electronics & Computers

Applying Wiring Harness Changes Without Damaging Your Electric System Design Flow

When an engineering change must be made to a wiring harness—and let’s face it, there is always going to be late-stage changes—it means you will make a change in multiple design steps. This Tech Talk discusses the challenges of applying changes and how to better handle them. For example, you might need to change an electric component that drives more current than the previous one. A change such as this can cause issues throughout your design flow: System Design, Wiring Design, and the Harness Design. The resulting inconsistencies lead to poor quality and prevent you from achieving your design cycle goals.

Posted in: Tech Talks, Electronics

Overcoming RF Signal Generation Challenges with New DAC Technologies

This features our new AWG5200, with high signal fidelity and the ability to scale up to 32 or more channels with multi-unit synchronization, all at an affordable price.

Posted in: White Papers, White Papers, Aerospace, Electronics & Computers, RF & Microwave Electronics

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