Tech Exchange

Technology Compensates for Audio

Microsoft  

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Flexible Absorbent Binder

Kimberly-Clark The Flexible Absorbent Binder (FAB), is a liquid coating that, once dry, forms a cross-linked, water absorbent hydrogel film on many substrates. The coating binds glass, metal, plastics, cellulose, and polypropylene, and may bind covalently to hydroxy-functional surfaces. The coating can also absorb moisture, bodily fluids, and other aqueous liquids; FAB may absorb many times its own weight in water, including salt water and potentially acidic solutions.

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Multiple Networks from One WiFi Card

Microsoft This software solution virtualizes multiple WiFi cards within the same computer. It creates two or more software WiFi cards in computer memory so that multiple WiFi connections can take place essentially at the same time, using a single WiFi card and antenna system. The same computer simultaneously can be connected to multiple access points, to different WiFi networks, to multiple nodes in an ad hoc network, or to multiple WiFi channels on the same network (or possibly all of these at the same time.)

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Diagnostic and Sorting Technologies

Agrotechnology & Food Innovations BV This non-invasive technology enables accurate plant quality assessments before any physiological change is perceived by the naked eye. Plants, and plant parts, can be assessed at any stage of growth. The technology is based on chlorophyll fluorescence, highly correlated to desired plant qualities. Stems, leaves, fruits, berries, and ears may be assessed — the technology is useful in the hothouse, field, or grocery store. Any plant with chlorophyll can be tested for seed vigor, germination, good growth, and freshness. Impacts from drought, herbicides, and insects are easily detectable long before becoming visible. Screening spot measurements can be done, or more general measurements performed, with an imaging detector on an area roughly 1 x 1.5 m.

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Technique Measures Material Properties

Applied Materials Developed for quality control and wafer metrology in the semiconductor manufacturing market, this non-destructive technology may be highly adaptable to measuring material properties such as a coating’s thickness, thermal and electrical conductivity, and material imperfections. The technology uses two overlapping lasers to measure the thickness of metal on a substrate using the metal’s known heat conductivity and reflectivity. Depending on the metal, thicknesses from 5 μm down to 100 Angstroms can be measured. The technology is sensitive to residues and extremely fine contaminants. Voids, breaks, bridges, or connections between fine metal lines can be detected. If there is a known differential in thermal conductivity between the surface metal deposition and its substrate, metal thickness can be deduced. The nominal laser spot size is 3 μm; measurements may be made to within approximately 20 μm from the edge of a work piece.

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