Special Coverage

Technique Provides Security for Multi-Robot Systems
Bringing New Vision to Laser Material Processing Systems
NASA Tests Lasers’ Ability to Transmit Data from Space
Converting from Hydraulic Cylinders to Electric Actuators
Automating Optimization and Design Tasks Across Disciplines
Vibration Tables Shake Up Aerospace and Car Testing
Supercomputer Cooling System Uses Refrigerant to Replace Water
Computer Chips Calculate and Store in an Integrated Unit
Electron-to-Photon Communication for Quantum Computing

Coming Soon - Technical Webinar Series from the Editors of TBMG: Advances in Wearable Technologies

Wearable devices are gaining widespread use in industries such as medical, military/defense, and consumer products. These devices range from passive monitors and diagnostic systems to complex surveillance devices. One area where great strides are currently being made are robotic prosthetics and powered exoskeleton bionic devices to help people with severe disabilities live more normal lives. As the technologies incorporated in these wearables – including sensors and electronics – become increasingly more complex, design engineers must learn how best to package and integrate them for maximum comfort, durability, and efficiency.

Posted in: Upcoming Webinars, Electronics

The Ins and Outs of Spaceflight Passive Components and Assemblies

RF and microwave components deployed in space flight applications can experience hundreds of degrees of temperature variation, massive amounts of radiation, and can be expected to operate at an elevated level for sometimes decades. The demands of operating in a space environment bring many unique challenges and unforgiving reliability requirements; therefore, designing passive components to meet these rigorous operation criteria necessitates a high level of design expertise, qualifications/certifications, and testing capability.

Posted in: White Papers, White Papers, Aerospace, Defense, Electronics & Computers, RF & Microwave Electronics

Overcome Connected Car Design and Test Challenges

Today, radar systems, such as adaptive cruise control, stop-and-go, blind spot detection, lane change assist, and rear crash warning, are being developed and integrated into automobiles to reduce possible collisions and prevent human casualties. Engineers are choosing the SystemVue Scenario Framework solution to increase design fidelity and save costs during design and test. Learn more by downloading the application note, Automotive FMCW Radar System Design Using 3D Framework for Scenario Modeling.

Posted in: White Papers, Automotive, Electronics & Computers, Test & Measurement

Modern Measurement Tools Information at Your Fingertips

It takes the right tools to perform a job well, so having the right set of test instruments and software on your bench is critical to ensuring your design meets all its requirements. It also takes having the right information available to you when you need it. Keysight Technologies has both a comprehensive library of information, and the broadest portfolio of bench solutions, fully equipped with capability that will safeguard you from overlooking critical measurements and analysis that could cause your end-product to fail in its intended market. So, whether your needs include understanding the power consumption of your device, providing clean dc and ac power, component characterizing, data acquisition, analyzing digital designs, software to automate your tests, or generating/visualizing waveforms, Keysight has essential bench solutions for your needs. Get the most benefit from your Keysight instruments with application notes, tips, product information and more – right at your fingertips.

Get your measurement resources

Posted in: White Papers, Electronics & Computers, Test & Measurement

Virtual Hardware ECU: How to Significantly Increase Testing Throughput

In Conjunction with SAE

Both the complexity and software content of automotive electronic systems are increasing rapidly. At the same time, the demand for more software and system testing is growing. This need is being driven by requirements from the ISO 26262 standard and the necessity to reduce software-driven recalls, which have been significantly rising over the past few years.

Posted in: Upcoming Webinars, Electronics

Connectivity Solutions - Keeping Pace with the Rapid Evolution of Embedded Computing Systems

Embedded Computing is seeing a rapid evolution in system design. New defense platforms and system upgrades are widely adopting open architecture standards like VPX in place of 20+ year old technologies. Defense-grade processors are now achieving 28Gbps data rates with significant I/O count, which drives increased functionality and enables computing hardware to shrink in size and weight.

Posted in: Upcoming Webinars, Defense, Electronics & Computers

Printed Electronics Primer: an Introduction to the Basics of Printed Electronics

This white paper provides an overview of how printed electronics (PE) can help you fit more functionality into smaller spaces, while maximizing cost efficiency. You will learn the basic terminology and gain an understanding of today’s PE industry, including prevalent technologies, materials and manufacturing processes.

Posted in: White Papers, Communications, Electronics & Computers, Medical

Recovering Metals from Electronic Waste

This process dissolves the major metals found in electronics, including materials that have been shredded, magnetically separated, or milled to a particle size less than one millimeter.

End-of-life electronic devices such as smartphones, computers, televisions, and other electronics contain significant amounts of valuable metals including base metals (zinc, tin, lead, nickel, and copper), precious metals (silver, gold, and palladium), and rare earth magnets (neodymium, yttrium, samarium). Some electronic scrap is currently landfilled or incinerated, and there is a need to develop more effective processes to capture these valuable metals along with keeping them out of the environment.

Posted in: Briefs, Electronics & Computers

Solder Bond Packaging for High-Voltage Pulsed Power Devices

This invention is a superior switching component for pulsed power applications.

The huge demand for switching components exceeding silicon's (Si) current density limitation of 200 A/cm2 has pushed the enhancement of alternative semiconductor materials such as silicon carbide (SiC), gallium nitride, and diamond. The enhanced material properties of SiC, such as high thermal conductivity, large critical field, wide bandgap, large elastic modulus, and high saturation velocity, make it a viable candidate for pulsed power systems. Using SiC would increase both current and power densities, improve dI/dt and dV/dt capabilities, reduce recovery time, and minimize switching losses in various power electronic systems. Furthermore, a significant reduction in the volume and weight of pulsed power systems can be realized by implementing SiC SGTOs, reducing the thermal management requirements of the pulsed power system.

Posted in: Briefs, Electronics & Computers

Virtual Fabrication and Assembly Documentation

Over the years, the term “virtual” has become associated with many different domains. Virtual machines are now commonplace as a substitute for physical laptops or desktops, allowing for the emulation of computer systems. Of course, virtual reality is in the news daily as new headsets, apps, and games provide a substitute for images and sounds, allowing for the simulation of a three-dimensional environment. In the printed circuit board (PCB) space, some fabrication and assembly information such as artwork, drill, netlist, test, and component placement have been conveyed virtually to manufacturing for more than 30 years.

Posted in: Articles, Electronics & Computers

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