Special Coverage

Supercomputer Cooling System Uses Refrigerant to Replace Water
Computer Chips Calculate and Store in an Integrated Unit
Electron-to-Photon Communication for Quantum Computing
Mechanoresponsive Healing Polymers
Variable Permeability Magnetometer Systems and Methods for Aerospace Applications
Evaluation Standard for Robotic Research
Small Robot Has Outstanding Vertical Agility
Smart Optical Material Characterization System and Method
Lightweight, Flexible Thermal Protection System for Fire Protection
Home

Conquering Radar Signal Generation

This Webinar will focus on the challenges related to the creation and generation of complex radar signals and provide you with some tools to help make this task more efficient. This 60-minute webinar features Tektronix expert Christopher Skach, who will share his insights on the key factors to consider when creating and generating these complex signals.

Posted in: On-Demand Webinars, Electronics & Computers

Read More >>

How to Make Custom SoC Smart

Custom SoCs are the new vogue: Analog is becoming smart, and there is a new wave of custom SoCs integrating analog and digital to create smaller, lower-cost products.

Posted in: Tech Talks, Electronics & Computers

Read More >>

Radar Signal Generation with a High-Performance AWG

Radar ensures the safety and security of the skies, and lives depend on it. That’s why radar design measurements call for high frequency, realistic stimulus signals. You need to create these complex radar test signals at high frequencies, but what’s the best solution?

Posted in: White Papers, White Papers, Aerospace, Defense, Electronics & Computers, RF & Microwave Electronics

Read More >>

A Modular Apparatus and Method for Attaching Multiple Devices

This technology improves the real-time monitoring of high-temperature or other harsh environments.Scientists at NASA's Glenn Research Center have received several patents for fabrication methods that speed the production of silicon carbide (SiC) sensors and electronics, reduce fabrication costs, and enable advanced semiconductor functionality at temperatures greater than 600 °C. Glenn has developed a method for fabricating ultra-thin SiC microstructures using a dopant selective reactive ion etching (DSRIE) technique that can create extremely thin diaphragms (approximately 2 microns), increasing sensor sensitivity and resolution. In addition, Glenn has developed a modular protective packaging that allows SiC-based electronic devices to survive and operate reliably at very high temperatures. These innovations improve the real-time monitoring of high-temperature harsh environments, such as jet and rocket engines, allowing faster response times and more accurate readings.

Posted in: Briefs, Electronics & Computers, Electronic equipment, Sensors and actuators, Fabrication, Silicon alloys, Protective structures

Read More >>

Wireless Electrical Device Using Open-Circuit Elements Having No Electrical Connections

This technology produces sensors for axial load force, linear displacement, rotation, strain, pressure, torque, and motion sensing.NASA Langley Research Center has developed a wireless, connection-free, open-circuit technology that can be used for developing electrical devices such as sensors that need no physical contact with the properties being measured. At the core of the technology is the SansEC (Sans Electrical Connections) circuit, which is damage-resilient and environmentally friendly to manufacture and use. The technology uses a NASA award-winning magnetic field response measurement acquisition device to provide power to the device and, in the case of a sensor application, to acquire physical property measurements from them. This fundamental new approach using open circuits enables applications such as sensors for axial load force, linear displacement, rotation, strain, pressure, torque, and motion sensing, as well as unique designs such as for a wireless keypad or wireless rotational dial, or for energy storage.

Posted in: Briefs, Electronics & Computers, Architecture, Integrated circuits, Sensors and actuators, Wireless communication systems, Electric power, Magnetic materials

Read More >>

ISO 26262 & Automotive Electronics Development

Compliance standards, especially those that involve relatively new functional safety elements, will likely add additional requirements to the development process. But ISO 26262, in particular, will add more than new requirements to the product life cycle for automotive hardware-software systems. This Functional Safety standard will act as a framework impacting integrated requirements traceability, risk management, validation, verification, documentation and collaboration throughout the systems engineering “V” model life cycle process (see Figure). ISO 26262 will also require the qualification of tools used to create automotive systems. This paper examines the impact of the standard on the development process and support tool chains for automotive electronics.

Posted in: Briefs, TSP, Electronics & Computers, Information Sciences, Semiconductors & ICs, Software, Computer software and hardware, Life cycle analysis, Safety regulations and standards

Read More >>

The Reality of Application Security: Scare Tactics or Genuine Threat?

Guardians of application security have perhaps become slightly immune to the fearful messages of cybersecurity vendors. The combination of ‘Big Data’ with an exponentially growing Internet of Things (IoT) would seem to provide the perfect storm conditions for the exploitation of vulnerable code streams. Read this whitepaper about the reality of AppSec to discover what are the real risks and how to mitigate them.

Posted in: White Papers, Automotive, Communications, Electronics & Computers, Information Sciences

Read More >>

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.