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Scientists Print in 4D

Scientists at the Wyss Institute for Biologically Inspired Engineering at Harvard University and the Harvard John A. Paulson School of Engineering and Applied Sciences have brought a fourth dimension to their microscale 3D printing technology.

Posted in: News

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Beetle-Inspired Patterning Prevents Frost

Taking a page from the beetle's playbook, Virginia Tech biomedical engineers created a way to control condensation and frost growth on airplane parts, condenser coils, and windshields.

Posted in: News, Coatings & Adhesives, Composites, Metals

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Researchers Test New Mars Spacesuits

To support Mars exploration, new spacesuits must protect astronauts, supply air and water, and be flexible enough to allow for small required tasks like the digging of samples. Engineers from the University of North Dakota are evaluating new spacesuit design at Kennedy Space Center.

Posted in: News

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Ultra Low Thermal Resistant Adhesives for Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are particularly versatile for bonding, sealing and coating. Moreover, the use of filler materials in adhesives can help to fine tune the specific performance demands required to extend product lifecycles and meet manufacturing requirements. Learn more about why and how ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.

Posted in: White Papers

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Adhesives, Sealants and Coatings for the Aerospace Industry

From prototype to assembly line, our materials have aided in the success of many companies across the aerospace industry. This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications.

Posted in: White Papers, White Papers

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Evaluating Electrically Insulating Epoxies

Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers and other variables are considered in this paper. The specific composition of resin and curing agents will also affect the electrical properties of a cured epoxy system. Three major types of curing agents are explained in this paper along with their benefits and trade-offs with respect to electrical properties.

Posted in: White Papers

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Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. There are a variety of potting formulations on the market today that suit the needs of diverse applications. Learn about the performance properties of each, plus the packaging options available, to see which is best suited for the manufacturing and assembly of your electronic device.

Posted in: White Papers

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