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Improving Single-Patient-Use Model with Disposable Blood Pressure Cuff

Single-use cuff could cut infection spread. Each year, hospital-acquired infections cost hospitals approximately $5 billion in the United States, according to a report in the American Journal of Infection Control. Reducing infection spread helps hospitals avoid these costs and improve patient safety. To help reduce cross-contamination, the Centers for Disease Control and Prevention recommend the use of patient-dedicated products. While catheters, gloves, and the like are high on the hospital’s radar to help address this, blood pressure cuffs are often overlooked, despite research that shows that blood pressure cuffs used on multiple patients can transmit pathogens such as MRSA or C. diff. The single-patient-use cuff solutions that do exist are traditionally expensive, wasteful, and difficult to implement.

Posted in: Bio-Medical, Manufacturing & Prototyping, Materials / Adhesives / Coatings, Materials, Plastics, Medical, Patient Monitoring, Briefs, MDB

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Differential Muon Tomography to Continuously Monitor Changes in the Composition of Subsurface Fluids

This innovation enables tracking of carbon storage or enhanced oil recovery in subsurface reservoir projects. Muon tomography has been used to seek hidden chambers in Egyptian pyramids and image subsurface features in volcanoes. It seemed likely that it could be used to image injected, supercritical carbon dioxide as it is emplaced in porous geological structures being used for carbon sequestration, and also to check on subsequent leakage. It should work equally well in any other application where there are two fluids of different densities, such as water and oil, or carbon dioxide and heavy oil in oil reservoirs.

Posted in: Materials, Briefs, TSP

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Conductive Carbon Nanotube Inks for Use with Desktop Inkjet Printing Technology

A mixture of carbon nanotubes and silver or gold nanoparticles could be applied by inkjet printing to flexible substrates. Inkjet printing is a common commercial process. In addition to the familiar use in printing documents from computers, it is also used in some industrial applications. For example, wire manufacturers are required by law to print the wire type, gauge, and safety information on the exterior of each foot of manufactured wire, and this is typically done with inkjet or laser printers.

Posted in: Materials, Briefs

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Enhanced Schapery Theory Software Development for Modeling Failure of Fiber-Reinforced Laminates

This tool captures the physics of the damage and failure mechanisms. Progressive damage and failure analysis (PDFA) tools are needed to predict the nonlinear response of advanced fiber-reinforced composite structures. Predictive tools should incorporate the underlying physics of the damage and failure mechanisms observed in the composite, and should utilize as few input parameters as possible.

Posted in: Materials, Briefs, TSP

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High-Performance, Low-Temperature-Operating, Long-Lifetime Aerospace Lubricants

The synthesis and characterization of six new ionic liquids, with fluoroether moeties on the imidazolium ring, each with vapor pressures shown to be

Posted in: Materials, Briefs, TSP

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Carbon Nanotube Microarrays Grown on Nanoflake Substrates

This process creates materials comprised predominantly of single-walled carbon nanotubes. This innovation consists of a new composition of matter where single-walled carbon nanotubes (SWNTs) are grown in aligned arrays from nanostructured flakes that are coated in Fe catalyst. This method of growth of aligned SWNTs, which can yield well over 400 percent SWNT mass per unit substrate mass, exceeds current yields for entangled SWNT growth. In addition, processing can be performed with minimal wet etching treatments, leaving aligned SWNTs with superior properties over those that exist in entangled mats.

Posted in: Materials, Briefs

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

Posted in: Materials, White Papers

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White Papers

X-Ray Imaging: Emerging Digital Technology - CMOS Detectors
Sponsored by Teledyne DALSA
How to Avoid Bearing Corrosion
Sponsored by Kaydon
Medical Capabilities Brochure
Sponsored by Nordson EFD
Force and Torque Measurement Traceability
Sponsored by Morehouse
Spherical Plain Bearing
Sponsored by AST Bearings
Estimating the Effort and Cost of a DO-254 Program
Sponsored by Logic Circuit

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