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Refractory Metal Fasteners for Extreme Conditions: The Basics

There is a wide range of metal fasteners commonly available for standard applications, but what if your application is at very high temperature or in a highly corrosive environment? Sometimes the more commonly available fasteners are just not up to the job. Enter high-performance refractory metal fasteners. Refractory metal fasteners – nuts, bolts (also called screws or machine screws) and washers – are ideal for situations that involve high temperature, high voltage, magnetism and harsh corrosive environments.

Posted in: Materials, White Papers

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Metal Injection Molding Turns the Volume Up, and Down

When increased quantities of metal parts are needed, metal injection molding (MIM) is often a logical next step. Our free MIM white paper covers the multi-step process involved in molding metal parts, detailed technical specs needed for design, commonly used materials and a comparison to other metal-forming technologies like direct metal laser sintering and die casting.

Posted in: Materials, White Papers

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Liquid Silicone Rubber Takes the Heat

Our comprehensive white paper on liquid silicone rubber provides a detailed look at the injection-molding process and offers guidelines to achieve better molded LSR parts. While there are some shared similarities to thermoplastic injection molding, LSR is a thermoset material with a unique set of design characteristics.

Posted in: Materials, White Papers

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Synthetic Sapphire: Extreme Performer

Sapphire, the single crystal form of alumina (Al2O3), was first synthesized more than a century ago, but the most exciting advances associated with this versatile material are taking place today. Shaped by the dual forces of application demands and technological advances in the fabrication and finishing process, synthetic sapphire is often the material of choice for design engineers dealing with extreme conditions of high temperature, high pressure and harsh chemical environments.

Posted in: Materials, White Papers

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Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

Posted in: Materials, White Papers

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Reliability Testing of GORE® Protective Vents in Telecommunication Enclosures

Premature failure of telecommunication equipment leads to network downtime, higher costs, increased maintenance and decreased brand loyalty. One of the most significant challenges for this equipment is withstanding the conditions of the environment in which it is installed.

Posted in: Materials, White Papers

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

Posted in: Materials, White Papers

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