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Symbolic Techniques for Model Code Optimization: FMI Applications

Since its inception, the FMI standard has become the primary method for model transfer and co-simulation, providing a smooth, error-free technique for design engineers to deliver their work without manual integration or resorting to other proprietary tools. At the same time, advanced symbolic technologies have emerged that provide extremely fast auto-generated code for the implementation of dynamic system models and enable advanced analysis applications. This paper describes symbolic techniques employed under the hood for dynamic system model formulation and optimized code generation. One application where the FMI standard has been used is for generating a functional mockup of an automatic transmission from MapleSim, and implementing it in dSPACE's SCALEXIO to perform a full-vehicle, real-time simulation.

Posted in: White Papers, Simulation Software

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Designing a Phased Array Antenna Using Antenna Magus and CST STUDIO SUITE

Antenna synthesis lets engineers investigate many potential designs and produce antennas that fit the specifications quickly. For effects that cannot be accounted for analytically such as edge effects and mutual coupling, full-wave 3D simulation can complement synthesis tools and allow designs to be checked and fine-tuned. This article explores the synthesis of an antenna array, using a phased array satellite communications antenna as an example.

Posted in: White Papers, White Papers

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RR1P Rugged ATR Pluggable Canister RAID Data Storage Delivers Continuous Data Recording for ISR

RR1P removable canister RAID data storage system enables military ISR data to be removed from a plane, ship or ground vehicle in under two minutes. The canister connects to the ¾ ATR chassis with a military grade connector designed for 10,000 insertion cycles. It weighs only 25 pounds including a five pound removable canister with up to 19.2 TB of compact, rugged, high performance mobile RAID data storage.

Posted in: White Papers, White Papers, Data Acquisition, Sensors, Electronics & Computers

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Multiphysics Modeling of MEMS Devices

There are many excellent reasons to simulate microelectromechanical system (MEMS) devices. For example, if you're going to create a new product or process, such as a capacitive pressure sensor, you'll first want to get the concepts right. The most important decisions are often made early in the product development cycle when multiphysics simulation can give you the valuable insight you need. The benefits of multiphysics simulation can also extend easily to the design and optimization of a product by reducing the time and money spent on prototypes. And, if you integrate multiphysics simulation with manufacturing and quality assurance, you'll end up with a product that's much better understood and better characterized.

Posted in: White Papers

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Overcome Challenges of Your Highly Constrained PCB Designs

Layout constraints are an essential part of a PCB design. As the technology in modern electronic devices has become more complex (e.g. increasing speed, decreasing rise time and supply voltage values), signal integrity issues have become a primary concern. For many designs, this means a large percentage of nets require PCB layout constraints to meet signal integrity requirements. This brings two major challenges: creating a proper set of layout constraints for your design and applying those constraints during the PCB layout design process. This paper shows how to address the challenges of highly constrained designs.

Posted in: White Papers

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Removing the Gap Between ECAD and MCAD Design

For ECAD and MCAD to collaborate in “real-time” a direct method of communication that facilitates a shared flow of data back and forth between design teams is required. This flow must support “what-if” scenarios of design baselines and change proposals along with the ability to counter-propose changes. Once design agreements are made, the flow must also dynamically update the design databases. This unique ECAD-MCAD (EDMD) collaborative environment has not been available until now. This desktop PCB design provides a real-time integrated ECAD-MCAD collaboration environment that enables Electrical and Mechanical design teams to work together throughout the entire design process.

Posted in: White Papers

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Avionics Reliability – Thermal Design Considerations

Thermal design for reliability faces challenges from power dissipation demands from increased processing, sensing and communication requirements plus targets for size, weight and operation. Address thermal challenges effectively with electronics cooling simulation that brings electronic and mechanical design flows closer.

Posted in: White Papers, White Papers

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3D Printing Materials: Choosing the Right Material
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Reliable Linear Motion For Packaging Machines
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Force Sensors for Design
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Sponsored by rohde and schwarz a and d
How Do You Assess Image Quality?
Sponsored by basler
Remediation and Prevention of Moisture in Electronics
Sponsored by multisorb technologies

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