Special Coverage

Home

Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

Posted in: Techs for License, Semiconductors & ICs

Read More >>

White Papers

Reliable Linear Motion For Packaging Machines
Sponsored by iko
Force Sensors for Design
Sponsored by Tekscan
Domestic Versus Offshore PCB Manufacturing
Sponsored by Sunstone Circuits
How Lean Manufacturing Adds Value to PCB Production
Sponsored by Sunstone Circuits
Improving Absorption Measurements through Light Source Selection
Sponsored by Ocean Optics
PICO xMOD Data Sheet
Sponsored by Nordson EFD

White Papers Sponsored By: