Special Coverage

Applying the Dynamic Inertia Measurement Method to Full-Scale Aerospace Vehicles
Method and Apparatus for Measuring Surface Air Pressure
Fully Premixed, Low-Emission, High-Pressure, Multi-Fuel Burner
Self-Healing Wire Insulation
Thermomechanical Methodology for Stabilizing Shape Memory Alloy (SMA) Response
Space Optical Communications Using Laser Beams
High Field Superconducting Magnets

Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

Posted in: Techs for License, Semiconductors & ICs


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Noise Analysis in Precision Analog Designs
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