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Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

Posted in: Techs for License, Techs for License

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