Webcasts

Conductive Inks Give New Meaning to the Term 'Printed' Circuit Boards

NASAs Marshall Space Flight Center has developed a novel nanosilver ink technology that provides a conductive ink system to suit a variety of printing applications. These include inkjet or direct-write 3D printing of electrodes, antennae or interconnects in printed electronic devices and systems, and applications where chemically etched, copper-printed circuit boards are used.

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Simulation of Microfluidics Phenomena in COMSOL Multiphysics®

Microfluidics applications include inkjet print heads, genomic and proteomic chips, chemical lab-on-a-chip devices, cell sorters, and others. As a result, microfluidics-based numerical simulations often incorporate fluid motion, chemical reactions, electric and magnetic fields, and fluid-structure interactions.

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Understanding New Robotics Trends So You Don’t Fall Behind

Components like cables and connectors must keep pace with today’s advanced robotics technology. Without a reliable source for power and signal, even the sturdiest robots will fail.

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Ensuring Reliability and Safety of Connected Car Technology

In conjunction with SAE The internet has now come to the automobile, bringing connectivity for infotainment, telematics and vehicle data analytics. The connected car is rapidly becoming a key node in the emerging Internet of Things. While connected car technology is a bonus and a pleasure for car buyers, it poses unprecedented new engineering challenges regarding reliability, safety and security for car manufacturers.

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Component Design with a Twist

Helixes in nature abound—from the formation of DNA, to the spiral of a seashell, to the tendril of a climbing vine. That is because the helical structure provides support for the curve through three-dimensional space. Taking a cue from nature, Fort Wayne Metals created its Helical Hollow Strand (HHS® Tube) with up to three layers to provide engineers with solutions to design problems that exceed the capabilities of conventional constructions.

Posted in: Webinars, On-Demand Webinars

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Technical Webinar Series from the Editors of SAE: Multimaterial Lightweighting

In Conjunction with SAE The quest to improve the fuel economy of vehicles is not waning, nor is the desire to achieve higher mpg through the use of just the right lightweight material for the right vehicle application. Advanced high-strength steel, aluminum, magnesium, composites, and other materials are all on the table to fulfill the industry’s safety and lightweighting goals.

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Identifying the Root Cause of EMC Compliance Problems at a PCB level

EMC chambers are not the best tool to use for debugging when a device fails compliance tests or to diagnose root causes of failures. Detection of emissions hot spots using hand held sniffer probes can be effective but it is slow and does not deliver a full board picture of the problem. The probe array based Very-Near-Field scanning technique developed by EMSCAN allows real-time evaluation of the spatial distribution of emissions over the entire board.

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