White Papers

Multi-Purpose Non-Contact Position/Displacement Sensing

FeaturesSupports both dual and single coil sensors Terminal I/O connections Auto-synchronization of multiple channels Analog DC and 4-20mA outputs Single ended, bipolar, and differential voltage outputs Front face coarse and fine calibration controls RoHS compliant and CE marked

Posted in: Sensors, White Papers

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Noncontact Differential Impedance Transducer

FeaturesTrue differential for common mode rejection at an economical price High precision eddy current balanced bridge technology Capable of subnanometer resolution Thermal stability ±.03% FS/°C, at null ±.005% FS/°C Small package size: just 7.7 cubic inches High sensitivity: up to 10V/mil (39mV/μm) Extremely linear, to 0.1% full range Single and dual channel configurations

Posted in: Sensors, White Papers

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Data Cabling for Today’s and Tomorrow’s Aircraft

As more advanced avionics, CMS and IFE systems make their way into aircraft, the amount of 10 gigabit cable deployed to support current and future systems is increasing. Unfortunately, the pathway space remains the same. Aerospace Engineers therefore need cables that meet highly reliable 10 gigabit signal transmission performance, while also taking up less space, lowering the total cable weight and providing installable performance irrespective of the tight pathways of an aircraft. Thermax’s new white paper discusses these optimum data cabling characteristics for meeting aircraft design challenges such as tight routing, harsher environments, and lighter, more fuel-efficient aircraft.

Posted in: Electronics & Computers, White Papers

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Video: Sigma-5 with EtherCAT. Case Study of Sigma-5 with EtherCAT Plasma Cutting Application

Case study of project that included W.A. Whitney Co., Rockford, IL (OEM) and Waymatic, Inc., South Fulton, TN (End User)

Posted in: Machinery & Automation, White Papers

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An Introduction to Lean Manufacturing

In production plants across the globe, lean manufacturing techniques are being utilized to meet increasing demands placed on manufacturers. Buyers now require quicker turnaround, better service, and higher quality – all at a competitive price. For many, these techniques have helped them to dramatically increase their competitive edge, while continuing to remove wasteful practices and contribute to the bottom line. In this white paper you will be introduced to the concept of lean manufacturing, its guiding principles, and how portable measurement technology can help you achieve your lean goals.

Posted in: Manufacturing & Prototyping, White Papers

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An Improved Method for Differential Conductance Measurements

As modern electronics continue to shrink, researchers are increasingly looking to nanotechnology as the basis for the next breakthrough in device size and power consumption. Indeed, as semiconductor structures are made smaller and smaller, the distinction between small silicon geometries and large molecules becomes blurred. Approached from either direction, the consequences are the same. Quantum behavior such as tunneling begins to play an important role in the electrical characteristics. In the macroscopic world, conductors may have obeyed Ohm’s Law (Figure 1a), but in the nanoscale, Ohm’s definition of resistance is no longer relevant (Figure 1b). Because the slope of the I-V curve is no longer a fundamental constant of the material, a detailed measurement of the slope of that I-V curve at every point is needed to study nanodevices. This plot of differential conductance (dG = dI/dV) is the most important measurement made on small scale devices, but presents a unique set of challenges.

Posted in: Test & Measurement, White Papers

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Gearing Up for Parametric Test’s High Voltage Future

Many parametric test engineers are learning to cope with new high voltage process requirements. Not surprisingly, high voltage processes require high voltage parametric testing for process control and reliability monitoring. Part of the challenge lies in the fact that these new high voltage requirements add to the list of parametric tests rather than replacing some portion of it. In many if not most cases, the high voltage transistors are controlled by complex logic that requires low voltage/low current parametric test. Consequently, both high voltage and logic tests have to be addressed within the same test plan while minimizing impact on throughput.

Posted in: Test & Measurement, White Papers

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