White Papers

Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing

Die attach adhesives serve a vital role in semi-conductor assembly, manufacturing and throughout the product life cycle. In this white paper, learn how they facilitate assembly and about the application process. Read why thin bond lines are so important for product life cycle. Bond strength is only one, albeit critical requirement for many applications; read about many other performance characteristics of epoxies and why they offer diverse solutions to meet critical application needs.

Posted in: White Papers, Electronics & Computers

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Assessing the Potential of Additive Manufacturing for Lower-Cost Tools in the Automotive Industry

As additive manufacturing (3D printing) capabilities evolve, so will its adoption within the automotive industry. This white paper explores the possibilities and offers evidence of notable opportunity in 3D printed tooling. Read the white paper to learn:

Posted in: White Papers, Aeronautics, Manufacturing & Prototyping, Coatings & Adhesives, Materials

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Polymeric Systems Bring Clarity to Optical Applications

Whereas some optical assembly applications require optical clarity across a certain wavelenth, others require an opaque coating. Optical grade epoxies, silicones and UV curable coatings provide the versatility to adhere well to a wide variety of substrates and the critical performance properties necessary. Learn more about optical transmission, refractive indices, temperature and humidity testing, and more, and the roles these measurements in choosing an effective and reliable optical polymer system.

Posted in: White Papers, Photonics

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Ultra Low Thermal Resistant Adhesives for Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are particularly versatile for bonding, sealing and coating. Moreover, the use of filler materials in adhesives can help to fine tune the specific performance demands required to extend product life cycles and meet manufacturing requirements. Learn more about why and how ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.

Posted in: White Papers, Electronics & Computers

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Conductive Coatings Protect Circuitry from EM/RF and ESD

With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Posted in: White Papers, Electronics & Computers, RF & Microwave Electronics

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Six Axes of Calibration

In a system or on a lab bench, proper instrument calibration reduces the chances of false test results. Not all calibrations are equal, and six key factors affect quality, usefulness and cost. In Six Axes of Calibration, we highlight the importance and value of each factor. Download application note.

Posted in: White Papers, RF & Microwave Electronics, Instrumentation, Test & Measurement

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Biomarker Sensor System and Method for Multi-Color Imaging and Processing of Single-Molecule Life Signatures

NASA’s Jet Propulsion Laboratory offers a method to manufacture biomarker sensor arrays with nanoscale resolution and active regions on the order of 1 micron by applying nanolithographic direct-write techniques to the fabrication of Silane chemistry sensors on a transparent substrate. This novel technology enables extremely fine patterns of detectors suitable for multicolor imaging of single-molecule samples at resolutions far below the diffraction limit. The extremely small size of these sensors allows for rapid, highly specific screening for hundreds of functionalities within a single, small, integrated microfluidics chip.

Posted in: Briefs, White Papers, Sensors

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