White Papers

TechTalk Design Advice Series: The Cable Distribution Rules You Need To Obey

The key advantage of a cable carrier is that bus and motor cables, pneumatics, electrics and hydraulics can all be guided safely in one system. However, correctly arranging each cable and hose within your chosen cable carrier according to the recommended spacing requirements is vital if you want to prolong the service life of your system.

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SWaP-C and Why Your Component Partner Matters

Is SWaP-C important to your project? Then working with the right contract manufacturer is critical to your success. From knowing the unique requirements of military requirements to having the capabilities to maximize component functionality, the right partner for your project can help you decrease the size, weight, power and cost of your electronics. Discover how to select the right partner and what questions to ask in our white paper, “SWaP-C and Why Your Component Partner Matters.” Download it now and learn techniques for ensuring that your next project is a successful one.

Posted in: White Papers, Electronics

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3D Printing: Changing the Economics of Manufacturing Custom Components

With traditional manufacturing technologies, the design and production of custom parts and products can be expensive and time-consuming. That’s because the economics of mass production require a large volume of finished goods over which to amortize the significant costs of prototypes, tooling, setup, assembly, materials, and finishing. Custom products, however, are manufactured in small lots, and for them, a different approach is required. One advanced technology that manufacturers are embracing for its ability to produce custom products quickly and profitably is additive manufacturing, or 3D printing. In this paper, Stratasys presents some of the ways in which 3D printing is enabling manufacturers to create custom products better, faster, and less expensively.

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Robust USP Class VI Silicone Alternative Reduces Time To Market For Medical Devices

Combining decades of field-proven life science experience, LEMO and Northwire’s collaborative white paper highlights the professional expertise and continual innovation necessary to design and manufacture end-to-end (E2E) connector and cable assembly solutions that meet the rapidly evolving demands of the medical market.

Posted in: White Papers, White Papers, Coatings & Adhesives

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Comparison of Interface Pressure Measurement Options

An increasingly competitive global marketplace means that design engineers must efficiently deliver a high quality product. Countless emerging technologies impact the design process and engineers must practice due diligence to ensure analysis tools meet their application’s requirements. This paper focuses specifically on technology for interface force and pressure measurement between two surfaces and includes a review of technology composition and data output. This paper will also examine capabilities driven by form factor, precision and environment that influence selection criteria of interface force and pressure sensors.

Posted in: White Papers, White Papers, Sensors

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Engaging stakeholders in the home medical device market

The Growing Home Medical Device Market – How Could It Impact Med Tech Stakeholders? 90% of patients prefer digital technology tools (such as mobile apps) over medication, per an October 2013 survey by Digitas Health. And, Semico Research's Aging in Place: The Internet of Things for the Golden Years forecasts that the home medical device market will reach $30 billion in revenues by 2017. Gain expert insight into engaging stakeholders of the growing home medical device market - including implications for manufacturers, intended device uses, end users, safety and essential performance, transformation requirements, mobile apps + more.

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High Reliability Flexible Circuits for the Medical Marketplace

Tech-Etch manufacturers high reliability flex circuits used in the diagnostic imaging, patient monitoring, cardiac management and life science industries. Flexible circuits provide the thinnest and lightest interconnect method available. Their extreme thinness makes them very well suited for dynamic applications where the flex will be in constant or periodic motion. They contribute to reducing overall system complexity by facilitating assembly and eliminating wiring errors. Flexible circuits will conform to the available geometry for connections of electronics located on different planes within the finished electronic device. This capability is sometimes referred to as 3D packaging.

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