White Papers

Evolution of the Modern Receiver in a Crowded Spectrum Environment

The International Telecommunications Union Radiocommunications working group (ITU-R) outlines recommendations for the regulations and procedures for federal radio frequency management. This white paper takes a look at the evolution from the analog spectrum analyzer to the modern digital receiver in line with ITU-R Recommendations. It also gives some examples of the importance of the new architecture in today’s spectrum environment.

Posted in: White Papers, White Papers, Aeronautics, Defense, RF & Microwave Electronics

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Improving Medical Devices with Force Sensing Technology

This white paper explores the exciting new trend toward designing smart medical devices that provide critical force feedback to eliminate guesswork, improve outcomes, and increase consistency. Technical topics covered include the unique advantages of force sensing resistor technology over traditional technologies such as strain gauges and load cells. These advantages include simpler electronics, wider dynamic range, ease of integration, and lower cost. The white paper highlights how thin and flexible sensors have enhanced a wide range of medical device applications by providing force feedback and making the products smart.

Posted in: White Papers, Sensors

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Mikrotron Cameras Bring Accuracy, High Performance, and Flexibility to 3D Trajectory Reconstruction

Static two-dimensional images have proven to be of great analytical value, but analysis in more dynamic environments depends upon accurate and continuous imaging of three-dimensional volumes. Fluid motion often presents that type of dynamic environment. For example, turbulent fluid flow through irregular media — such as water flow along a gravel streambed — is almost impossible to represent with a closed-form mathematical model. To study such situations, researchers turn to a technique called 3D particle tracking velocimetry, or 3D-PTV. Mikrotron cameras have proven to be invaluable elements of high-performance 3D-PTV systems.

Posted in: White Papers, Imaging

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Avoiding Common Mistakes in Extractables/Leachables Program Design

Mistakes in program design for extractables/leachables testing can lead to significant delays, rounds of questions, and the need for additional testing. And, in some cases, all of the extractables/leachables testing may need to be repeated. To avoid these costly mistakes, it is important to understand the current standards as well as the current interpretations and opinions from regulators interpreting these standards. In this whitepaper the experts from WuXi AppTec discuss the current standards, interpretations and will provide you with tips to avoid common mistakes when designing your program.

Posted in: White Papers, White Papers, Medical

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External Power Supply Efficiency Regulation Introduction

Presently Energy Efficiency Level V is mandatory in Canada and throughout Europe. In February 2016 Energy Efficiency Level VI will become mandatory in the United States. Attached are the details of the pending change, but in brief, both the standby power draw and efficiency of the operating power supplies must meet minimum levels set in the standard. MEGA is in the process of updating our product line to comply with the coming changes.

Posted in: White Papers, Electronics, Electronics & Computers

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Designing a Phased Array Antenna Using Antenna Magus and CST STUDIO SUITE

Antenna synthesis lets engineers investigate many potential designs and produce antennas that fit the specifications quickly. For effects that cannot be accounted for analytically such as edge effects and mutual coupling, full-wave 3D simulation can complement synthesis tools and allow designs to be checked and fine-tuned. This article explores the synthesis of an antenna array, using a phased array satellite communications antenna as an example.

Posted in: White Papers, White Papers, Aerospace, Software

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Adhesion Reduction of Semiconductor Dicing Tape

Many semiconductor wafer processing techniques involve the fixing of a thin layer of dicing tape to a wafer during the final processing stages. To allow removal of the die from the tape, the adhesion properties of the tape may be reduced with exposure to high-intensity UV light.

Posted in: White Papers, Coatings & Adhesives, Materials

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