White Papers

A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

Posted in: Materials, White Papers

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Achieving High Reliability SAC Solder Joints via Min Doping

In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys. SACM is a patent pending alloy consisting of 0.5-1% Ag, 0.5-1% Cu, <0.1% Mn. SACM alloy achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for many test conditions. More significantly, SACM matched SAC305 in thermal cycling performance. In other words, the low cost SACM achieved a better drop test performance than the low Ag SAC alloys, plus the desired thermal cycling reliability of high Ag SAC alloys. The mechanism for high drop shock performance and high thermal cycling reliability can be attributed to a stabilized microstructure, with uniform distribution of fine IMC particles, presumably through the inclusion of Mn in the IMC. The cyclic bending results showed SAC305 to be the best and all lead-free alloys were equal or superior to SnPb. The reliability test results also showed that NiAu is a preferred surface finish for BGA packages over OSP.

Posted in: Materials, White Papers

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Inclinometers for Motion Control

Inclinometers can provide a simple, economic and highly effective way of measuring and controlling the movement of objects in a wide variety of mechanical systems. They have been used successfully many applications, including industrial automation, construction machinery, mining and resource extraction equipment and medical systems. This white paper provides a brief description of the technologies employed in industrial inclinometers, outlines the key features of the various designs and provides guidance in the selection of the best instruments for a task.

Posted in: Sensors, White Papers

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Primer on Laser Micromachining of Polymer-Based Life Science Products

Resonetics is the leader in laser micromachining polymers for life sciences. We solve challenges to manufacture sub-millimeter features. We laser material up to 1mm thick with features down to 2µm in diameter. The Lightspeed ADL™ is equipped with laser workstations for process development and prototyping. Resonetics offers the largest capacity for laser micromachining polymers in ultra-violet wavelengths. Our 64,000 sq. ft. site has a 6,000 sq. ft. Class 8 cleanroom and more than 50 laser workstations.

Posted in: Medical, White Papers, MDB

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Turning Great Designs Into Great Products: The Changing World of Mechanical Design

As the nature of product development shifts to keep up with the pace of global innovation, manufacturers must understand that using the wrong tools can cripple a company's ability to innovate and deliver quality products on time. This whitepaper provides an overview of manufacturing tools like mechanical computer aided design (MCAD), product data management (PDM), electronic design automation (EDA) and enterprise resource planning (ERP) and describes how to bridge the gap between engineering and manufacturing.

Posted in: Manufacturing & Prototyping, White Papers

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Implementation of Real-time Spectrum Analysis

The keys to real-time spectrum analysis are to provide parallel sampling and FFT calculations so the data acquisition continues while the FFT’s are performed, and to provide fast enough DSP processing of FFT algorithms to keep up with the sample rate at the input. This white paper discusses the technical implementation of the real-time process in the Rohde & Schwarz real-time analyzers, and the applications for use of this analysis capability in the troubleshooting and test of modern designs.

Posted in: Test & Measurement, White Papers

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Oscilloscope Fundamentals

The oscilloscope is arguably one of the most useful tools ever created for use by electronic engineers. In the more than five decades since the modern analog oscilloscope was created, hundreds of useful documents and thousands of articles have been written about what it is, how it works, how to use it, and application-specific examples of the “oscilloscope” in action. It is the purpose of this primer to instead describe digital oscilloscopes, which have for practical purposes replaced their analog predecessors in the vast majority of applications. Covered here is a short description of the oscilloscope’s origins, its transition from analog to digital, types of digital oscilloscopes and their major subsystems, key benchmark specifications, and measurements.

Posted in: Test & Measurement, White Papers

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