White Papers

Made in Space: 3D Printing in Zero-G

NASA’s In-Space Manufacturing (ISM) project is responsible for developing the manufacturing capabilities that will provide on-demand, sustainable operations during NASA long-duration missions to destinations such as Mars. The very first step in the initial part of ISM was getting the first 3D printer into space. A 3D printer had never flown in space until the 3D Printing in Zero-G experiment was launched on SpaceX-4 on September 21, 2014. This demonstration was the first attempt to test the effects of microgravity on additive manufacturing in space. The printer was designed and built by Made in Space under a NASA Small Business Innovation Research (SBIR) contract. Learn how NASA and Made In Space worked together to design, develop, and deploy the printer, and how they are taking the next steps to create an Additive Manufacturing Facility in space.

Posted in: White Papers, Manufacturing & Prototyping

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Successful Test Management For Systems Engineers

Designing a reliable test strategy requires broad, strategic thinking. The goal of verification is to ensure you release a best-quality system that meets customer expectations as documented in your early design concept and requirements gathering phases. To maximize the value of your test process, test your product objectives early.

Posted in: White Papers, White Papers, Aeronautics, Defense, Electronics, Electronics & Computers

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Delivering Roadworthy Designs: Automotive Electronics Circuit Protection Overview, Applications & Standards

Today’s automotive designs include nearly 100 microprocessors; that number is expected to double in five years. From in-dash displays to connected technologies and safety systems, all onboard electronics require circuit protection to maintain reliability. The major sources of electrical hazards in automotive systems are electrostatic discharge (ESD), switching loads in power electronics circuits, and lightning. Overcoming transient surges that can harm the vehicle’s electronics, whether under the hood or in the cabin, is one of the biggest obstacles of system design.

Posted in: White Papers, Automotive, Electronics, Electronics & Computers

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Optimizing Performance with Technology Embedded Apparel

Intercomp USA’s latest e-book delves into the smart garment market and how sensors are crucial for making garments smart. More importantly, Intercomp reveals an exciting new technology called tailored fiber placement (TFP), available through its partnership with LayStitch. TFP promises to help with smart garment production and will enable aerospace, automotive and other equipment manufacturers to produce parts that are lighter, stronger and less expensive. Click here to download your FREE copy today or visit intercomp.com to learn more.

Posted in: White Papers, Aeronautics, Electronics & Computers, Energy, Medical

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Computer Aided Design of Suspension Mechanisms

Automobile suspension mechanisms have to date been designed using two-dimensional graphic oriented methods. Computer-aided design has allowed many two-dimensional mechanisms to be designed much more accurately. However, this has not translated to suspension mechanisms because these mechanisms are not two-dimensional but instead three-dimensional.

Posted in: White Papers, Electronics & Computers, Manufacturing & Prototyping, Software, Test & Measurement

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Risky Business: Why Excluding Suppliers from Your Quality Processes Could Cost You

Suppliers play a major role in bringing products to market. This means that the product received from suppliers must be of the highest quality and level of safety possible—this is a must because stakeholders not only rely on their suppliers to help bring products to market, they also rely on them to help maintain their brand image. In this White Paper, you'll learn how to incorporate suppliers into your quality and compliance activities, resulting in a greater level of assurance.

Posted in: White Papers, White Papers, Medical

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High Reliability Flexible Circuits for the Medical Marketplace

Tech-Etch manufacturers high reliability flex circuits used in the diagnostic imaging, patient monitoring, cardiac management and life science industries. Flexible circuits provide the thinnest and lightest interconnect method available. Their extreme thinness makes them very well suited for dynamic applications where the flex will be in constant or periodic motion. They contribute to reducing overall system complexity by facilitating assembly and eliminating wiring errors. Flexible circuits will conform to the available geometry for connections of electronics located on different planes within the finished electronic device. This capability is sometimes referred to as 3D packaging.

Posted in: MDB, White Papers, White Papers, Medical

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