The Digital Image Correlation Technology (DIC) is a non-contact 3D measurement tool that measures deformation and strain during material testing. DIC is a single system that replaces strain gages, accelerometers, LVDT’s, string potentiometers, extensometers, laser trackers, and surface scanners. The results are full field, and presented as an experimental representation of a finite model.

DIC is material independent - metals, composites, polymers, plastics - , and multi-scale – as small as small as a microchip to as large as an airplane. DIC is also very accurate, and has been extensively validated against strain gages for its strain measurements, and LVDT’s for its displacement measurements.

The data collected can be used for precision material characterization – Young’s modulus, poisson’s, etc. – or for comparing with FEA. Current users have applications in materials research, aerospace, automotive, microelectronics, medical sciences, and consumer products.

This webinar will run 60 minutes with the last 15 minutes for speaker engagement and Q+A.

Join this webinar to see:

  • How this advanced measurement tool can fit into your existing measurement and validation workflows.
  • Applications examples that span industrial use across multi-length and multi-time scales from forces that include mechanical, thermal, environmental, and vibration
  • Real examples of the validation of DIC vs strain gages, LVDT’s, FEA and other tools

Who needs to know about this technology?

  • If you are involved in mechanical testing or material characterization, you need to know.
  • If you are involved in product quality, you need to know.
  • If you create finite element models and need experimental data for validation, you need to know.

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