Breaking Through the Walls of Thermal Management

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Featuring high thermally conductive fillers, Master Bond EP48TC is a two component epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance, which imparts impressive heat transfer capabilities and thermal conductivity. It complies with NASA low outgassing specifications and can be used in applications in a variety of high-tech industries.


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Materials