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Product Spotlight: Supreme 3HTND-2DM

Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. Click to learn more. 

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    Transcript

    00:00:01 [Music] master bond supreme 3ht ND to DM is a rapid keyring toughened one part epoxy system used for the dam and so method for chip on board and capsulation there are two methods to protect chips in their wire bond glob topping is where the encapsulating system is dispensed and applied directly to the area to be protected danman filling entails

    00:00:35 dispensing the damning material around the area to be encapsulated the dam and filled process begins by attaching the die to the circuit board and moves on to wire bonding when that portion of the application is complete supreme 3ht ND to DM is readily dispensed from a syringe for automated dispensing system to create a structurally sound barrier this material will cure in place and

    00:01:02 will not run in essence forming a damn then a flowable encapsulants is applied to cover the remaining area to be protected this thermally conductive electrically insulating compound meets NASA low outgassing specifications its inherent toughness allows it to withstand the most intense types of thermal cycling the noteworthy characteristics of supreme 3h TNB dash

    00:01:29 to DM also make it ideal for use in various bonding and ceiling applications requiring a barrier to block flow it is available for use in syringes cartridges and jars for more information contact us to discuss your application you [Music]