Electronic Circuit Stickers Enable Large-Scale 'Internet of Things'
As more objects and devices are connected to the internet, the technology that enables these objects to communicate and sense each other will need to scale up. Engineers at Purdue University and the University of Virginia have developed a fabrication method called transfer printing, which makes electronic films that can be cut and pasted onto any object. These electronic stickers can turn ordinary toy blocks into high-tech sensors within the 'Internet of Things.’ The thin-film electronic circuit can peel easily from its silicon wafer with water, making the wafer reusable for building a nearly infinite number of circuits.
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Transcript
00:00:01 - We have developed a concept of transfer printing process which allows us to provide somewhat, a sticker-like thin film sensors or electronics. The industrial-grade thin film devices are typically fabricated on a silicon wafer. Our technology is to remove this thick silicon wafer from the the functional thin film devices. Now, this functional device is sitting on the temporary, reusable tape such that, you can very easily cut off
00:00:35 unnecessary part of the systems. Then afterwards, you can attach this predefined shape of thin film devices onto specific target surface. Any place of interest such as, just existing desk, building window, whiteboard, and meters, et cetera. One key advantage of this approach is that you can define additional functionality on the surface of existing product
00:01:04 without the need of additional manufacturing process. (bright music)