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White Paper: Power

How Dual-Curing Adhesives (UV Light + Heat ) Improve Manufacturing

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For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.


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Overview

The white paper from Master Bond Inc. discusses the advantages of dual curing adhesives that utilize both UV light and heat in manufacturing processes. These adhesives, particularly cationic UV curable systems, have revolutionized the industry by offering a single-component solution that simplifies the bonding process. Unlike traditional two-component adhesives, UV curable adhesives do not require precise mixing or monitoring of pot-life, allowing for unlimited working time and greater operational flexibility.

One of the key benefits of UV curable adhesives is their fast cure-on-demand nature, which is especially advantageous for thermally sensitive substrates. These formulations are typically 100% reactive, free from volatile carriers or solvents, and energy-efficient. They can cure in ambient air and are less affected by oxygen inhibition, which is a common challenge in UV curing. However, the paper also highlights potential drawbacks, such as the risk of under-cure in shadowed areas, which can lead to inconsistent material properties and limit adhesive thickness and joint design.

To address these limitations, Master Bond has developed dual-curing products like UV15DC80 and UV22DC80-1, which combine UV curing with low-temperature thermal post-cure capabilities, effective at temperatures as low as 80°C. These products are designed for various applications and offer outstanding mechanical, thermal, and electrical properties.

The paper emphasizes the importance of viscosity and rheology control in achieving high-quality manufacturing and assembly. Different rheological behaviors, such as shear-thinning and thixotropy, can be tailored to meet specific application demands. For instance, low-viscosity compounds are ideal for spin coating in photolithography, while medium viscosity adhesives can help control bond thickness during dispensing.

Additionally, the white paper discusses the future of UV curing technology, particularly the development of UV LED systems that emit at narrow wavelengths, providing enhanced safety, energy efficiency, and cooler operation compared to traditional UV lamps. Master Bond is also exploring the use of their products in 3D printing applications, where photo-polymerizable resins with thermal post-cure can enhance the properties and resilience of printed objects.

In conclusion, the white paper presents dual curing adhesives as a transformative solution for manufacturing, addressing traditional adhesive challenges while offering improved performance and efficiency. For further inquiries, Master Bond encourages contacting their technical experts.